DA1453x development kit mainboard rev.B5 [610-01-B]
Released: Mar'21, 2024

!readme.txt                             	this file
da1453x_devkt-p_vb5-1-4-np.drl			drill file (non-plated thru holes)
da1453x_devkt-p_vb5-1-4.drl			drill file (plated thru holes)
da1453x_devkt-p_vb5-1-4.rou			mill data (contains 2 slots)
OUTLINE.art					board outline (RS274X)
ASSEMBLY_BOT.art				bottom assembly (RS274X)
MASK_BOT.art					bottom mask film (RS274X)
SILK_BOT.art					bottom silkscreen (RS274X)
BOTTOM.art					bottom circuit (RS274X)
FAB.art						drill and manufacturing notes (RS274X)
INT1.art					Internal layer 1 (RS274X)
INT2.art					Internal layer 2 (RS274X)
TOP.art						top circuit (RS274X)
ASSEMBLY_TOP.art				top assembly (RS274X)
MASK_TOP.art					top mask (RS274X)
PASTE_TOP.art					top paste (RS274X)
SILK_TOP.art					top silkscreen (RS274X)

4-layer PCB, total finished thickness 1.55mm +/- 0.1mm (see also FAB.art)
minimum trace width: 125um/5mil
minimum copper clearance 125um/5mil

Final finish: WHITE legend over GREEN MATT LPI mask, both sides, ENIG plating on unmasked copper areas

Panelize as 1x1 array (i.e. add a cutout panel around the PCB)

Place UL94 and any other manufacturing markings at the designated area on the top (see also ASSEMBLY_TOP.art)
