DA1459x development kit mainboard rev.D [469-16-D]
Released: June'26, 2023

!readme.txt                             	this file
da1459x-mb-pro_vd-1-6-np.drl			drill file (non-plated thru holes)
da1459x-mb-pro_vd-1-6.drl			drill file (plated thru holes)
da1459x-mb-pro_vd-1-6.rou			mill data (contains 6 slots)
BOARD_OUTLINE.art				board outline (RS274X)
BOT_ASSEMBLY.art				bottom assembly (RS274X)
BOT_MASK.art					bottom mask film (RS274X)
BOT_SILK.art					bottom silkscreen (RS274X)
BOTTOM.art					bottom circuit (RS274X)
FAB.art						drill and manufacturing notes (RS274X)
L2_INT1.art					Internal layer 1 (RS274X)
L3_INT2.art					Internal layer 2 (RS274X)
L4_INT3.art					Internal layer 3 (RS274X)
L5_INT4.art					Internal layer 4 (RS274X)
TOP.art						top circuit (RS274X)
TOP_ASSEMBLY.art				top assembly (RS274X)
TOP_MASK.art					top mask (RS274X)
TOP_PASTE.art					top paste (RS274X)
TOP_SILK.art					top silkscreen (RS274X)

6-layer PCB, total finished thickness 1.55mm +/- 0.1mm (see also FAB.art)
minimum trace width: 125um/5mil
minimum copper clearance 125um/5mil

Final finish: WHITE legend over GREEN MATT LPI mask, both sides, ENIG plating on unmasked copper areas

Panelize as 1x1 (i.e. add a cutout panel around the PCB)

Place UL94 and any other manufacturing markings at the designated area on the top (see also ASSEMBLY_TOP.art)
