RENESAS Electronics
DA1470x development kit daughterboard rev.B [500-06-B]
Released: Nov'8, 2021

!readme.txt                             	this file
da1470x-db-vfbga142_vb-1-2-laser.drl		drill file (blind microvia 1-2)
da1470x-db-vfbga142_vb-1-8-np.drl		drill file (non-plated thru holes)
da1470x-db-vfbga142_vb-2-3-laser.drl		drill file (blind microvia 2-3)
da1470x-db-vfbga142_vb-3-6.drl			drill file (buried via 3-6)
da1470x-db-vfbga142_vb-6-7-laser.drl		drill file (blind microvia 6-7)
da1470x-db-vfbga142_vb-7-8-laser.drl		drill file (blind microvia 7-8)
BOARD_OUTLINE.art				board outline (RS274X)
BOT_ASSEMBLY.art				bottom assembly (RS274X)
BOT_MASK.art					bottom mask film (RS274X)
BOT_SILK.art					bottom silk screen (RS274X)
BOTTOM.art					bottom circuit (RS274X)
BOTTOM_PASTE.art				bottom paste (RS274X)
FAB.art						drill and manufacturing notes (RS274X)
L2_INT1.art					Internal layer 1 (RS274X)
L3_INT2.art					Internal layer 2 (RS274X)
L4_INT3.art					Internal layer 3 (RS274X)
L5_INT4.art					Internal layer 4 (RS274X)
L6_INT5.art					Internal layer 5 (RS274X)
L7_INT6.art					Internal layer 6 (RS274X)
TOP.art						top circuit (RS274X)
TOP_ASSEMBLY.art				top assembly (RS274X)
TOP_MASK.art					top mask (RS274X)
TOP_PASTE.art					top paste (RS274X)
TOP_SILK.art					top silk screen (RS274X)

8-layer PCB, total finished thickness 1.1mm +/- 0.1mm (see also FAB.art)
laser drilled blind microvias on layers 1-2, 2-3, 6-7, 7-8 (see also FAB.art)
buried via on layers 3-6 (see also FAB.art)
desired thickness of microvia dielectrics 65um (if needed adjust upto +/- 5um)
minimum trace width: 89um/3.5mil
minimum copper clearance 80um/3.15mil

Final finish: WHITE legend over GREEN MATT LPI mask, both sides, ENIG plating on unmasked copper areas

Panelize as 3x4 array

Place UL94 and any other manufacturing markings at the designated area on the bottom (see also BOT_ASSEMBLY.art)
