DA1470x development kit mainboard rev.D [500-05-C]
Released: Nov'23, 2021

!readme.txt                             	this file
da1470x_mb_pro_vd-1-2-laser.drl			drill file (blind microvia 1-2)
da1470x_mb_pro_vd-1-6-np.drl			drill file (non-plated thru holes)
da1470x_mb_pro_vd-1-6.drl			drill file (plated thru holes)
BOARD_OUTLINE.art				board outline (RS274X)
BOT_ASSEMBLY.art				bottom assembly (RS274X)
BOT_MASK.art					bottom mask film (RS274X)
BOT_SILK.art					bottom silk screen (RS274X)
BOTTOM.art					bottom circuit (RS274X)
BOTTOM_PASTE.art				bottom paste (RS274X - empty)
FAB.art						drill and manufacturing notes (RS274X)
INT1.art					Internal layer 1 (RS274X)
INT2.art					Internal layer 2 (RS274X)
INT3.art					Internal layer 3 (RS274X)
INT4.art					Internal layer 4 (RS274X)
TOP.art						top circuit (RS274X)
TOP_ASSEMBLY.art				top assembly (RS274X)
TOP_MASK.art					top mask (RS274X)
TOP_PASTE.art					top paste (RS274X)
TOP_SILK.art					top silk screen (RS274X)

6-layer PCB, total finished thickness 1.5mm +/- 0.1mm (see also FAB.art)
laser drilled blind microvias on layers 1-2 (see also FAB.art)
desired thickness of microvia dielectrics 75um (if needed adjust upto +/- 10um)
minimum trace width: 100um/4mil
minimum copper clearance 100um/4mil

Final finish: WHITE legend over GREEN MATT LPI mask, both sides, ENIG plating on unmasked copper areas

Panelize as 1x1 array (i.e. add a cutout panel around the PCB)

Place UL94 and any other manufacturing markings at the designated area on the top (see also BOT_ASSEMBLY.art)

For any questions please contact:
Panos Raftopoulos
e-mail: panagiotis.raftopoulos.vt@renesas.com
Direct Dial: +30 2610390955
Mobile: +30 6948306658