
 5/25/2010

 Intersil, Inc
 Atlanta, GA

 "ISL35411-DRZ" rev.B  PCB  **** FABRICATION DETAIL FILE ****
                                  ---------------------

 Design contact:        Bill Hosford 770-596-2923
 E-mail:                bhosford@intersil.com

 FILES                    Description / stack-up
 ----------               --------------------------------
 BRD_OUT.gbr              Board outline

 LYR-1.gbr                Top Layer-1 etch (.0007" plated up to .0018")
   -----                     --- core (.0080" finished thickness) RO-4003 
 LYR-2.gbr                Layer-2 etch (inner plane) (1 oz)
   -----                     --- filler (.035" approx finished thickness) FR-406, or appropriate filler 
 LYR-3.gbr                Layer-3 etch (inner plane) (1 oz)
   -----                     --- core (.008" finished thickness) FR-406, or appropriate filler
 LYR-4.gbr                Bottom Layer etch (.0007" plated up to .0018")

 SPT.gbr                  Solderpaste top layer (OK to modify as needed for maximum production yield)

 SPB.gbr                  Solderpaste bottom layer

 SS-TX.gbr                Legend, top-layer - BLACK ink
 (no bottom-side legend)
 
 Router (cut-outs) -      Gerber provided is CENTERLINE for .0625" router-bit diameter ONLY. 
 ----------------         If using another diameter bit, ADJUST centerline for cut-out OUTER
                          dimensions.
 
 ROUTE.gbr                Contour (router) control file -
                          Based on .0625" router-bit diameter

 NPT_Pre-Route.ncd        NPT pre-drill for route-corners to be drilled BEFORE cut-out routing 

 PTH-Drill.ncd            Plated Drill control file


 Fab detail
==========================================

 ** Note: ROUTER CONTROL FILE ("RTE-1.gbr") is CENTER-LINE for .0625" bit diameter ONLY.
    All dimensions are finished (end of process) unless otherwise noted.

 - All Drill sizes (diameters) are PRIMARY (no over-size drilling)

 - Rodgers RO-4003 dielectric on outer top layer; other suitable filler is OK for inner-layer
   and bottom-layer dielectrics.
 - No soldermask
 - Silkscreen/Legend on top layer only
 - Outer/copper high-speed layers (.0018" finished thickness)
   .008" FINISHED R-4003 dielectric between Layers 1 & 2.
 - Stack-up to give a TOTAL BOARD THICKNESS of .056"  +/- 10%
 - All holes are +/-.003" tolerance, PRIMARY drill only (no over-size drilling).
 - Emersion Silver solderable finish for all exterior copper. Approx. thickness ~ .5 uIN.
 - There is no separate "fab-drawing" file. Use this file, Gerbers, and Drill files
   as absolute references for design.
 - General quality and mfg tolerances to be according to industry 
   standard practices (IPC600c).

 Other NOTES:
 --------------

 WARNING:  COPPER FEATURES ON TOP LAYER-1 ARE INTENTIONAL BY DESIGN.
           DO NOT MAKE ANY COPPER (ETCH) CHANGES WITHOUT EXPRESS 
           WRITTEN PERMISSION FROM Bill Hosford.


