文档标题 信息
Package Name W4X4.16B
Package Previous Code WFG
Package Description 4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Package Status Active
Package Type WLCSP-TCURDL
类别 PLASTIC
Package Code WFG
分类 PLASTIC
Lead Count 16
Pb (Lead) Free Yes
长度 1.66mm
宽度 1.66mm
Thickness 0.5mm
Pitch 0.4mm
Pkg. Dimensions (mm) 1.66 x 1.66 x 0.50

文档
类型 文档标题 日期
Package Outline Drawing
Package Drawing WLCSP-TCURDL 16pin W4X4.16B
PDF 93 KB
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