Learn more about Renesas' packaging technology

Renesas Electronics' package technology makes its semiconductor products more functional, faster, and smaller, which enables multi-functional, high-speed solutions as well as compact, high-density mounting for space limited applications.

Basics

Explanation of basic functions and variations:

Technical Information

Reference for designers and process engineers in electronic equipment:

Package and Packing Outline

文档

The mounting manuals describe mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.

文档标题
类型 日期
半导体封装安装手册
PDF 15.77 MB English(英语) , 日文 		其他
LGA Mounting Manual
PDF 1.02 MB 日文 		其他
QFN 封装安装手册
PDF 4.16 MB English(英语) , 日文 		其他
3 items