Learn more about Renesas' packaging technology

Renesas Electronics' package technology makes its semiconductor products more functional, faster, and smaller, which enables multi-functional, high-speed solutions as well as compact, high-density mounting for space limited applications.


Explanation of basic functions and variations:

Technical Information

Reference for designers and process engineers in electronic equipment:


The mounting manuals describe mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.

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其他 PDF 15.77 MB English(英语) , 日文
其他 PDF 1.02 MB 日文
其他 PDF 4.16 MB English(英语) , 日文
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