文档标题 信息
Package Name W6X6.36D
Package Previous Code WPZ
Package Description 6x6 36 balls, 0.4mm Pitch, WLCSP; ASE Chung-Li
Package Status Active
Package Type WLCSP-BP
Package Code WPZ
分类 PLASTIC
Lead Count 36
Pb (Lead) Free Yes
长度 2.41mm
宽度 2.41mm
Thickness 0.5mm
Pitch 0.4mm
Pkg. Dimensions (mm) 2.41 x 2.41 x 0.50

文档
类型 文档标题 日期
Package Outline Drawing
W6x6.36D: 36 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
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