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产品编号 | 文档标题 | 类型 | 公司 |
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SMART-USB-DONGLE | Smart USB Dongle Featuring the SmartBond™ DA14683 Bluetooth® Low Energy 5.0 SoC | 开发 | Smart Sensor Devices |
BLUETOOTH-LE-TINY-CLICK | Mikroe Bluetooth® LE TINY Click™ with SmartBond™ DA14531 Module | 开发 | MikroElektronika |
Murata-Type-ZF | Murata Type ZF Bluetooth® Low Energy Module | 开发 | Murata Manufacturing Co., Ltd. Logo |
Murata-Type-ZY | Murata Type ZY Bluetooth® Low Energy Module | 开发 | Murata Manufacturing Co., Ltd. Logo |
PAN1740 | Panasonic Bluetooth® Low Energy Module | 开发 | Panasonic Corporation of North America |
SESUB-PAN-DA14580 | TDK Bluetooth® Low Energy Module | 开发 | TDK Corporation |
FTCLICK | MikroBUS™ Compatible Interface Module | 开发 | MikroElektronika |
BDE-BLEM301 | Bluetooth® 5.1 Low Energy Module | 开发 | BDE Technology Inc. |
PAN1740A | Panasonic Bluetooth® 5.0 with Small Size (DA14585) | 开发 | Panasonic Corporation of North America |
HJ-DA16200 | DA16200 Hongjia HJ-DA16200 Wi-Fi SIP Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
CK-RA6M5 | Cloud Kit Based on RA6M5 MCU Group | 开发 | Renesas |
CK-RX65N | Cloud Kit Based on RX65N MCU Group | 开发 | Renesas |
DA7400-DEVKT | DA7400 Development Kit | 开发 | Renesas |
SLG4SA-DIP | GreenPAK DIP Adapter for GreenPAK Advanced Development Board | 开发 | Renesas |
SLG46855AP-SKT | GreenPAK SLG46855-AP Development Kit with Socket Adapter | 开发 | Renesas |
SLG46827AG-SKT | GreenPAK SLG46827-AG Development Kit with Socket | 开发 | Renesas |
DA14706-00HZDEVKT-P | SmartBond™ DA1470x 蓝牙低功耗开发套件(专业版) | 开发 | Renesas |
DA14706-00HZDB-P | SmartBond™ DA14706 蓝牙低功耗子板 | 开发 | Renesas |
DA14708-00HZDB-P | SmartBond™ DA14708 蓝牙低功耗子板 | 开发 | Renesas |
RC21008_31008-PROG | VersaClock® 7 可编程时钟编程板 | 开发 | Renesas |
RC21012_31012-PROG | VersaClock® 7 可编程时钟编程板 | 开发 | Renesas |
eDVP | eCUBE DVP Development Platform (Camera Board for R-Car V3H Starter Kit) by Lacroix | 开发 | Lacroix Impulse |
RTK0EMA270C00000BJ | MCB-RA6T2 CPU Board for RA6T2 MCU Group | 开发 | Renesas |
SLG47115V-DIP | HVPAK SLG47115 20-pin DIP Prototyping Board | 开发 | Renesas |
SLG47115V-SKT | HVPAK SLG47115 Development Kit with Socket Adapter | 开发 | Renesas |
SPARKFUN-THING-PLUS-DA16200 | SparkFun Thing Plus - DA16200 Features a Highly Integrated Low Power Wi-Fi SoC for Developing Wi-Fi and IoT Solutions | 开发 | SparkFun Electronics |
DA14531-01FXDB-P | SmartBond TINY™ DA14531-01 Bluetooth® Low Energy Dev Kit Pro - FCGQFN24 Daughterboard | 开发 | Renesas |
AVSHORIZONE | Avnet Silica HoriZone RA Powered by Renesas | 开发 | Avnet |
EBV-IOT-SMARTCTHERM | RA6M3 + SmartCTherm Smart IoT Sensor Node Solution for Monitoring Indoor Climate Conditions | 开发 | Avnet |
TW001-VUI-RISCVPOCZ | 瑞萨 ASSP EASY 语音 HMI 套件 | 开发 | Renesas |
AB2-AML100 | Aspinity AB2 AML100 Application Board | 开发 | Aspinity, Inc. |
QCIoT-Arducam-Mega | 面向物联网的 SPI 摄像头 – ArduCam Mega | 开发 | Renesas |
SLG46537M-DIP | GreenPAK SLG46537 (MSTQFN-20) 20 引脚 DIP 原型开发板 | 开发 | Renesas |
DA14695MOD-00DEVKT-P | SmartBond™ DA14695模块低功耗蓝牙5.2开发套件专业版 | 开发 | Renesas |
DA14695MOD-00F1DB-P | SmartBond ™ DA14695 低功耗蓝牙5.2 模块开发套件 Pro - 子板 | 开发 | Renesas |
SLG46538M-DIP | GreenPAK SLG46538 (MSTQFN-20) 20 引脚 DIP 原型开发板 | 开发 | Renesas |
SLG46580V-DIP | GreenPAK SLG46580 (STQFN-20) 20 针 DIP 原型开发板 | 开发 | Renesas |
SLG46582V-DIP | GreenPAK SLG46582 (STQFN-20) 20 针 DIP 原型开发板 | 开发 | Renesas |
SLG46583V-DIP | GreenPAK SLG46583 (STQFN-20) 20 针 DIP 原型板 | 开发 | Renesas |
PORTENTA-C33 | Arduino Portenta C33 for Developing Cost-effective, Real-time Applications | 开发 | Arduino Pro |
UNO-R4 | Arduino UNO R4 32-bit MCU Prototyping Board | 开发 | Arduino Pro |
SLG4DVKLITE | GreenPAK Lite Development Board | 开发 | Renesas |
DA14592-01O9DB-P | SmartBond™ DA14592 低功耗蓝牙® 5.2 子板 | 开发 | Renesas |
DA14592-016FDB-P | SmartBond™ DA14592低功耗蓝牙® 5.2 子板 | 开发 | Renesas |
DA14592-016FDEVKT-P | SmartBond™ DA14592低功耗蓝牙® 5.2 SoC 开发套件 Pro | 开发 | Renesas |
RTK0EMA5K0S00020BJ | MCK-RA8T1 瑞萨适用于RA8T1 MCU群组的灵活电机控制套件 | 开发 | Renesas |
RTK0EMA5K0C00000BJ | 用于 RA8T1 单片机组的 MCB-RA8T1 CPU 板 | 开发 | Renesas |
DA14535-00FXDB-P | SmartBond™ DA14535 Bluetooth® Low Energy 5.3 SoC 开发套件专业版子板 | 开发 | Renesas |
DA14535-00FXDEVKT-P | SmartBond TINY™ DA14535 Bluetooth® Low Energy 5.3 SoC 开发套件专业版 | 开发 | Renesas |
FPB-R9A02G021 | FPB-R9A02G021 RISC-V MCU 快速原型板 | 开发 | Renesas |