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产品编号 | 文档标题 | 类型 | 公司 |
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SLG46721V-SKT | GreenPAK SLG46721 Development Kit with Socket Adapter | 开发 | Renesas |
SLG47115V-SKT | HVPAK SLG47115 Development Kit with Socket Adapter | 开发 | Renesas |
RTK7AECLD2S00001BU | AE-CLOUD2 - Global LTE IoT Connectivity Example | 开发 | Renesas |
SLG46517M-DIP | GreenPAK SLG46517 20-pin DIP Prototyping Board | 开发 | Renesas |
DA14683-00A9DEVKT-P | SmartBond™ DA14683 Bluetooth Low Energy 5.0 Development Kit Pro | 开发 | Renesas |
SLG46722V-DIP | GreenPAK SLG46722 20-pin DIP Prototyping Board | 开发 | Renesas |
YSAECLOUD2 | AE-CLOUD2 – Google Cloud Platform IoT Connectivity Example | 开发 | Renesas |
SLG46517M-SKT | GreenPAK SLG46517 Development Kit with Socket Adapter | 开发 | Renesas |
DA14683-00A9DEVKT-U | SmartBond™ DA14683 Bluetooth Low Energy Basic Development Kit | 开发 | Renesas |
SLG46722V-SKT | GreenPAK SLG46722 Development Kit with Socket Adapter | 开发 | Renesas |
DA14531-01FXDB-P | SmartBond TINY™ DA14531-01 Bluetooth® Low Energy Dev Kit Pro - FCGQFN24 Daughterboard | 开发 | Renesas |
RTK7DKS124S00002BU | DK-S124开发套件 | 开发 | Renesas |
SLG46533M-DIP | GreenPAK SLG46533M 20-pin DIP Prototyping Board | 开发 | Renesas |
DA14683-00U2DB-P | SmartBond™ DA14683 Bluetooth Low Energy 5.1 Development Kit Pro - WL-CSP53 Daughterboard | 开发 | Renesas |
SLG46811V-DIP | GreenPAK SLG46811 20-pin DIP Prototyping Board | 开发 | Renesas |
DK-S128 | DK-S128开发套件 | 开发 | Renesas |
SLG46533M-SKT | GreenPAK SLG46533M Development Kit with Socket Adapter | 开发 | Renesas |
DA14695-00HQDB-P | SmartBond™ DA14695 Bluetooth® Low Energy 5.2 Development Kit Pro - VFBGA86 Daughterboard | 开发 | Renesas |
SLG46811V-SKT | GreenPAK SLG46811 Development Kit with Socket Adapter | 开发 | Renesas |
DK-S7G2 | DK-S7G2开发套件 | 开发 | Renesas |
SLG46533V-DIP | GreenPAK SLG46533V 20-pin DIP Prototyping Board | 开发 | Renesas |
DA14695-00HQDEVKT-P | SmartBond™ DA14695 Bluetooth Low Energy 5.2 Development Kit Pro | 开发 | Renesas |
SLG46824G-SKT | GreenPAK SLG46824 (TSSOP-20) Development Kit with Socket Adapter | 开发 | Renesas |
TW001-VUI-RISCVPOCZ | 瑞萨 ASSP EASY 语音 HMI 套件 | 开发 | Renesas |
RTK7PEHMP1S00002BU | PE-HMI1产品示例 | 开发 | Renesas |
SLG46533V-SKT | GreenPAK SLG46533V Development Kit with Socket Adapter | 开发 | Renesas |
DA14695-00HQDEVKT-RANG | SmartBond™ Wireless Ranging (WiRa™) Software Development Kit | 开发 | Renesas |
SLG46824V-DIP | GreenPAK SLG46824 20-pin DIP Prototyping Board | 开发 | Renesas |
PORTENTA-C33 | Arduino Portenta C33 for Developing Cost-effective, Real-time Applications | 开发 | Arduino Pro |
UNO-R4 | Arduino UNO R4 32-bit MCU Prototyping Board | 开发 | Arduino Pro |
AB2-AML100 | Aspinity AB2 AML100 Application Board | 开发 | Aspinity, Inc. |
AVSHORIZONE | Avnet Silica HoriZone RA Powered by Renesas | 开发 | Avnet |
EBV-IOT-SMARTCTHERM | RA6M3 + SmartCTherm Smart IoT Sensor Node Solution for Monitoring Indoor Climate Conditions | 开发 | Avnet |
BDE-BLEM301 | Bluetooth® 5.1 Low Energy Module | 开发 | BDE Technology Inc. |
eCUBE | Lacroix 的 eCUBE 开发平台 | 开发 | Lacroix Impulse |
eDVP | eCUBE DVP Development Platform (Camera Board for R-Car V3H Starter Kit) by Lacroix | 开发 | Lacroix Impulse |
EagleCAM | 来自 LUPA 的 EagleCAM 智能摄像头平台 | 开发 | LUPA-Electronics GmbH |
BLUETOOTH-LE-TINY-CLICK | Mikroe Bluetooth® LE TINY Click™ with SmartBond™ DA14531 Module | 开发 | MikroElektronika |
FTCLICK | MikroBUS™ Compatible Interface Module | 开发 | MikroElektronika |
LP-WiFi-Click | Ultra-Low Power Wi-Fi Solution Add-On Board Featuring the DA16200 Wi-Fi Module | 开发 | MikroElektronika |
Murata-Type-ZF | Murata Type ZF Bluetooth® Low Energy Module | 开发 | Murata Manufacturing Co., Ltd. Logo |
Murata-Type-ZY | Murata Type ZY Bluetooth® Low Energy Module | 开发 | Murata Manufacturing Co., Ltd. Logo |
PAN1740 | Panasonic Bluetooth® Low Energy Module | 开发 | Panasonic Corporation of North America |
PAN1740A | Panasonic Bluetooth® 5.0 with Small Size (DA14585) | 开发 | Panasonic Corporation of North America |
SMART-USB-DONGLE | Smart USB Dongle Featuring the SmartBond™ DA14683 Bluetooth® Low Energy 5.0 SoC | 开发 | Smart Sensor Devices |
SPARKFUN-THING-PLUS-DA16200 | SparkFun Thing Plus - DA16200 Features a Highly Integrated Low Power Wi-Fi SoC for Developing Wi-Fi and IoT Solutions | 开发 | SparkFun Electronics |
SPARKFUN-QWIIC-DA16200 | SparkFun Qwiic Wi-Fi Shield Featuring the Ultra-Low Power DA16200 Wi-Fi Module | 开发 | SparkFun Electronics |
SPARKFUN-MICROMOD-DA16200 | SparkFun MicroMod WiFi Function Board Featuring the Ultra-Low Power DA16200 Wi-Fi Module | 开发 | SparkFun Electronics |
HJ-DA16200 | DA16200 Hongjia HJ-DA16200 Wi-Fi SIP Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
HJ-131IMH | DA14531 Hongjia HJ-131IMH Ultra-Small, Ultra-Low Power Bluetooth 5.1 SIP Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |