图像
产品编号 | 文档标题 | 类型 | 公司 |
---|---|---|---|
SESUB-PAN-DA14580 | TDK Bluetooth® Low Energy Module | 开发 | TDK Corporation |
SESUB-PAN-DA14580 | TDK Bluetooth® Low Energy Module | 开发 | TDK Corporation |
HJ-DA16200 | DA16200 Hongjia HJ-DA16200 Wi-Fi SIP Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
HJ-131IMH | DA14531 Hongjia HJ-131IMH Ultra-Small, Ultra-Low Power Bluetooth 5.1 SIP Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
HJ-580CY | DA14580 HongJia HJ-580CY Bluetooth® Low Energy 4.2 Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
HJ-531IMF | DA14531 Hongjia HJ-531IMF Ultra-Small, Ultra-Low Power Bluetooth 5.1 SIP Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
SPARKFUN-THING-PLUS-DA16200 | SparkFun Thing Plus - DA16200 Features a Highly Integrated Low Power Wi-Fi SoC for Developing Wi-Fi and IoT Solutions | 开发 | SparkFun Electronics |
SPARKFUN-QWIIC-DA16200 | SparkFun Qwiic Wi-Fi Shield Featuring the Ultra-Low Power DA16200 Wi-Fi Module | 开发 | SparkFun Electronics |
SPARKFUN-MICROMOD-DA16200 | SparkFun MicroMod WiFi Function Board Featuring the Ultra-Low Power DA16200 Wi-Fi Module | 开发 | SparkFun Electronics |
SMART-USB-DONGLE | Smart USB Dongle Featuring the SmartBond™ DA14683 Bluetooth® Low Energy 5.0 SoC | 开发 | Smart Sensor Devices |
PAN1740 | Panasonic Bluetooth® Low Energy Module | 开发 | Panasonic Corporation of North America |
PAN1740A | Panasonic Bluetooth® 5.0 with Small Size (DA14585) | 开发 | Panasonic Corporation of North America |
Murata-Type-ZF | Murata Type ZF Bluetooth® Low Energy Module | 开发 | Murata Manufacturing Co., Ltd. Logo |
Murata-Type-ZY | Murata Type ZY Bluetooth® Low Energy Module | 开发 | Murata Manufacturing Co., Ltd. Logo |
FTCLICK | MikroBUS™ Compatible Interface Module | 开发 | MikroElektronika |
LP-WiFi-Click | Ultra-Low Power Wi-Fi Solution Add-On Board Featuring the DA16200 Wi-Fi Module | 开发 | MikroElektronika |
BLUETOOTH-LE-TINY-CLICK | Mikroe Bluetooth® LE TINY Click™ with SmartBond™ DA14531 Module | 开发 | MikroElektronika |
EagleCAM | 来自 LUPA 的 EagleCAM 智能摄像头平台 | 开发 | LUPA-Electronics GmbH |
eCUBE | Lacroix 的 eCUBE 开发平台 | 开发 | Lacroix Impulse |
eDVP | eCUBE DVP Development Platform (Camera Board for R-Car V3H Starter Kit) by Lacroix | 开发 | Lacroix Impulse |
BDE-BLEM301 | Bluetooth® 5.1 Low Energy Module | 开发 | BDE Technology Inc. |
AVSHORIZONE | Avnet Silica HoriZone RA Powered by Renesas | 开发 | Avnet |
EBV-IOT-SMARTCTHERM | RA6M3 + SmartCTherm Smart IoT Sensor Node Solution for Monitoring Indoor Climate Conditions | 开发 | Avnet |
AB2-AML100 | Aspinity AB2 AML100 Application Board | 开发 | Aspinity, Inc. |
PORTENTA-C33 | Arduino Portenta C33 for Developing Cost-effective, Real-time Applications | 开发 | Arduino Pro |
UNO-R4 | Arduino UNO R4 32-bit MCU Prototyping Board | 开发 | Arduino Pro |
DA14AVDDECTDEVKT | Audio Voice Data (AVD) Module Development Kit | 开发 | Renesas |
SLG46826V-DIP | GreenPAK SLG46826 20-pin DIP Prototyping Board | 开发 | Renesas |
DA14695MOD-00DEVKT-P | SmartBond™ DA14695模块低功耗蓝牙5.2开发套件专业版 | 开发 | Renesas |
SLG46535V-DIP | GreenPAK SLG46535 20-pin DIP Prototyping Board | 开发 | Renesas |
DA16200MOD-DEVKT | DA16200 Ultra-Low Power Wi-Fi Modules Development Kit | 开发 | Renesas |
SLG46826V-SKT | GreenPAK SLG46826 (STQFN-20) Development Kit with Socket Adapter | 开发 | Renesas |
DA14695MOD-00F1DB-P | SmartBond ™ DA14695 低功耗蓝牙5.2 模块开发套件 Pro - 子板 | 开发 | Renesas |
SLG46535V-SKT | GreenPAK SLG46535 Development Kit with Socket Adapter | 开发 | Renesas |
DA16200MOD-DEVKT-P | DA16200 超低功耗 Wi-Fi 模块开发套件 Pro | 开发 | Renesas |
SLG46827AG-SKT | GreenPAK SLG46827-A Development Kit with Socket Adapter | 开发 | Renesas |
SLG46538M-DIP | GreenPAK SLG46538 (MSTQFN-20) 20 引脚 DIP 原型开发板 | 开发 | Renesas |
R-CAR-SDK | R-Car 软件开发套件 | 开发 | Renesas |
SLG46536V-DIP | GreenPAK SLG46536 20-pin DIP Prototyping Board | 开发 | Renesas |
DA16600MOD-DEVKT | DA16600 Ultra-Low Power Wi-Fi + Bluetooth Low Energy Modules Development Kit | 开发 | Renesas |
SLG46855AP-DIP | GreenPAK SLG46855-A 20-pin DIP Prototyping Board | 开发 | Renesas |
SLG46580V-DIP | GreenPAK SLG46580 (STQFN-20) 20 针 DIP 原型开发板 | 开发 | Renesas |
RTK0EMA270S00020BJ | MCK-RA6T2 瑞萨适用于RA6T2 MCU群组的灵活电机控制套件 | 开发 | Renesas |
SLG46536V-SKT | GreenPAK SLG46536 Development Kit with Socket Adapter | 开发 | Renesas |
DA16600MOD-DEVKT-P | DA16600 Ultra-Low Power Wi-Fi + Bluetooth Low Energy Modules Development Kit - Pro | 开发 | Renesas |
SLG46855V-DIP | GreenPAK SLG46855 20-pin DIP Prototyping Board | 开发 | Renesas |
SLG46582V-DIP | GreenPAK SLG46582 (STQFN-20) 20 针 DIP 原型开发板 | 开发 | Renesas |
RTK0EM0000S04020BJ | MCI-LV-1 瑞萨灵活电机控制变频器电路板 — 低电压48V/10A 适用于三相 BLDC/PMSM 电机 | 开发 | Renesas |
SLG46537M-SKT | GreenPAK SLG46537 (MSTQFN-22) Development Kit with Socket Adapter | 开发 | Renesas |
SC14ULEDEVKT | SC14ULEDEVKT | 开发 | Renesas |