文档标题 | 信息 |
---|---|
Pkg. Name Name used to describe Renesas packages.
|
M20.3 |
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MGY |
Package Description Descriptive text for this package.
|
20 LEAD SOIC (300MIL) |
Package Status | Active |
Package Type | SOICW |
类别 | PLASTIC |
Package Code The unique identifier of this package.
|
MGY |
分类 | PLASTIC |
Lead Count | 20 |
Pb (Lead) Free | Yes |
长度 | 12.85mm |
宽度 | 7.52mm |
Thickness Seated height or Package height
(Please check the outline drawing) |
0mm |
Pitch | 1.27mm |
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
12.85 x 7.52 x 0.00 |