Results: 162 webinars
Wireless Connectivity
Medical & Healthcare
In this webinar, you will learn about:
- How Connectivity is transforming Connected Health and Fitness Applications
- Key target applications
- Customer references
- How Connectivity is transforming Connected Health and Fitness Applications
- Key target applications
- Customer references
Sensor Products, Microcontrollers & Microprocessors, Wireless Connectivity
Consumer Electronics, Building Automation
In this webinar, you will learn about:
・Connectivity’s place in the connected home and building
・Key target applications and Renesas Connectivity portfolio
・Our customers success stories
・Connectivity’s place in the connected home and building
・Key target applications and Renesas Connectivity portfolio
・Our customers success stories
Microcontrollers & Microprocessors
Artificial Intelligence (AI)
In this webinar session, we will show you how to make your products smarter with sensors and TinyML. You will learn how Renesas low-power, general purpose MCUs with TinyML can enable your products to:
- Recognize and localize sounds
- Recognize non-visual gestures (capacitive, radar, motion, etc.)
- Detect anomalies in smart equipment
- Recognize and localize sounds
- Recognize non-visual gestures (capacitive, radar, motion, etc.)
- Detect anomalies in smart equipment
Microcontrollers & Microprocessors
Artificial Intelligence (AI)
In this webinar, you will:
- Hear directly from engineers on how to use the compact and cost-effective dual-core Arm® Cortex®-A55 RZ/V2L microprocessor-based Single Board Computer (SBC), tailored for embedded Vision and Vision AI applications.
- Learn how this SBC can help to accelerate your system design and the available options to use this SBC directly in your product.
- Hear directly from engineers on how to use the compact and cost-effective dual-core Arm® Cortex®-A55 RZ/V2L microprocessor-based Single Board Computer (SBC), tailored for embedded Vision and Vision AI applications.
- Learn how this SBC can help to accelerate your system design and the available options to use this SBC directly in your product.
本次网络研讨会介绍的参考板是一款包含功能安全设计专业知识的评估板。 双配置系统，包括基于功能安全标准要求的诊断和监控电路，允许用户立即开始原型设计和软件开发。
在本次网络研讨会中，您将了解：
- 使用参考硬件板的优势
- 如何设置电路板，如何使用瑞萨电子免费试用功能安全软件
在本次网络研讨会中，您将了解：
- 使用参考硬件板的优势
- 如何设置电路板，如何使用瑞萨电子免费试用功能安全软件
Microcontrollers & Microprocessors
Artificial Intelligence (AI)
Register now to listen to the on-demand panel discussion
Listen in as an esteemed industry panel discusses the ways AI is already being used and implemented in various facets of the semiconductor industry. Moderated by Gartner, the panel took place during the SEMICON West/DAC 2023 Conference in San Francisco and included industry experts such as Renesas, TinyML, Synopsys, and Advantest.
The panel discussion focuses on how AI is reshaping the semiconductor industry and provides a 360-degree view of the ways AI is being implemented in the chipmaking process, and how its adoption by end customers is changing the face of the electronics industry.
Listen in as an esteemed industry panel discusses the ways AI is already being used and implemented in various facets of the semiconductor industry. Moderated by Gartner, the panel took place during the SEMICON West/DAC 2023 Conference in San Francisco and included industry experts such as Renesas, TinyML, Synopsys, and Advantest.
The panel discussion focuses on how AI is reshaping the semiconductor industry and provides a 360-degree view of the ways AI is being implemented in the chipmaking process, and how its adoption by end customers is changing the face of the electronics industry.
在本次网络研讨会中，您将学习如何使用 EtherCAT 构建可扩展的高性能伺服控制系统，以及如何重复使用您的设计成果来扩展和缩减应用需求
本次网络研讨会内容：
1) 如何使用 EtherCAT 构建可扩展的高性能伺服控制器系统。
2) RZ/T2L MPU 的高性能架构
3) 生态系统和软件组件的广泛支持，包括 Renesas 灵活软件包、功能安全解决方案、信息安全解决方案、编码器接口等
本次网络研讨会内容：
1) 如何使用 EtherCAT 构建可扩展的高性能伺服控制器系统。
2) RZ/T2L MPU 的高性能架构
3) 生态系统和软件组件的广泛支持，包括 Renesas 灵活软件包、功能安全解决方案、信息安全解决方案、编码器接口等
RF Products
Communications Infrastructure, Wearables, Appliances
The SmartBond™ app by Renesas is a generic Bluetooth® LE mobile app, which aims to provide access to all features that are available by the Android and iOS Bluetooth APIs.
This webinar will provide a demonstration of the SmartBond™ app key features and functionality.
This webinar will provide a demonstration of the SmartBond™ app key features and functionality.
In this webinar, we cover:
- Graphics in IoT applications with DA1470x
- Graphics scenario management
- Graphics subsystem architecture
- Wearable UI example application
- Graphics in IoT applications with DA1470x
- Graphics scenario management
- Graphics subsystem architecture
- Wearable UI example application
In this free, 60-minute webinar, Dr Marta Martínez Vázquez of Renesas will present the basics of mmWave radar for automotive applications and underline the challenges and trade-offs in radar design.
Key topics and takeaways:
・Understand the basics of mmWave automotive radar
・Discover the trade-offs that must be considered during the design process
・Explore different radar architectures
・Learn how to implement various radar applications with practical 4D radar detection and imaging radar examples
Key topics and takeaways:
・Understand the basics of mmWave automotive radar
・Discover the trade-offs that must be considered during the design process
・Explore different radar architectures
・Learn how to implement various radar applications with practical 4D radar detection and imaging radar examples
越来越多的嵌入式产品开始接入物联网，实现方式多种多样。可靠、安全、灵活、易于实现，这些都是开发者所需的。瑞萨的 32 位 MCU 产品，通过芯片本身的硬件安全功能实现网络连接的信任根，结合丰富的软件环境，实现多种灵活可靠的网络接入。此次研讨会着重介绍 RA 和 RX MCU 物联网连接解决方案。
瑞萨MCU不断提高性能，拓展功能，以更好的服务于客户的应用。本次讲解了TFU，IIR，Analog三个方面的新应用。依靠面向马达控制的三角函数单元，可以提供快速、精确、底波动的解决方案，同时可以减少ROM需求尺寸。IIR Filter的应用可以减少执行时间，提高代码效率。Analog功能也变得日益强大，16bit ADC的应用，可以很大的提高ADC的精度，拓宽了MCU应用领域。内置可编程增益放大功能，可以方便客户应用，减少BOM成本。12位DAC和高速模拟比较器，也极大了方便了客户的应用。本次将详细介绍这些应用，并提供样例工程使用的说明，支持用户快速掌握和应用这些功能。
Automotive Products
Automotive, Electric & Hybrid Vehicles (EV)
Renesas is designing and manufacturing Microcontrollers, Analog, Power and Sensor devices for Automotive applications. To bring out the full capabilities of our devices and make the designers’ life easy, we build solutions using our winning combinations of our products/ICs. For the demanding applications in Electric Vehicles, we have built solutions for Inverters using Inductive Position Sensor (IPS). In today’s fast paced & short design cycles, building everything from scratch in conventional method is time consuming. Hence, we, at Renesas have built Models and software to support design engineers to bring out solutions quicker to market. Renesas has made complete hardware solution of these important blocks in EV for Two-wheeler as well as for Four-wheeler.
Our xEV inverter application model & software solution reduces research and development effort. With the use of inductive position sensor we saves the cost and enhances the performance of the solution.
Our xEV inverter application model & software solution reduces research and development effort. With the use of inductive position sensor we saves the cost and enhances the performance of the solution.
本演讲在介绍 FSP 的基础上，着重介绍 FSP 最新版本4.0.0的一些新特性。希望通过此次演讲，让各位工程师了解并熟悉瑞萨 RA 系列产品开发工具。FSP，即瑞萨电子灵活配置软件包，是一款增强型软件包，旨在为使用瑞萨电子 RA 系列 ARM 微控制器的嵌入式系统设计提供简单易用且可扩展的高质量软件。
目前整车电气架构正在逐步从400V系统向800V系统过渡，这对EV的动力系统包括BMS（Battery Management System）以及Inverter也提出了严峻的挑战，
瑞萨下一代锂电池模拟前端采集器支持16-CELL电芯同步零延时采集，ASIL-D功能安全等级, 双向冗余菊花链通信。针对新电气架构下的Inverter的需求，
积极部署下一代支持可用于800V系统下的IGBT/SiC功率器件预驱芯片，以及支持ASIL-C级别电感式电机位置传感器方案，与传统的旋变相比较，
具有巨大的成本优势以及性能提升。
瑞萨下一代锂电池模拟前端采集器支持16-CELL电芯同步零延时采集，ASIL-D功能安全等级, 双向冗余菊花链通信。针对新电气架构下的Inverter的需求，
积极部署下一代支持可用于800V系统下的IGBT/SiC功率器件预驱芯片，以及支持ASIL-C级别电感式电机位置传感器方案，与传统的旋变相比较，
具有巨大的成本优势以及性能提升。