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Microcontrollers for Mobile Device Applications

封装信息

Lead Count (#) 112
Pkg. Code pkg_723
Pkg. Type LFBGA
Pkg. Dimensions (mm) 10 x 10 x 1.4

环境和出口类别

RoHS (DF2218UBR24DV) 英语日文
Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL)
ECCN (US)
HTS (US)

产品属性

CPU H8S/2000
Bit Size 16
RAM (KB) 12
Program Memory (KB) 128
Lead Count (#) 112
Operating Freq (Max) (MHz) 24
Timer 16-bit x 3-ch
ADC 10-bit x 6-ch
RTC Yes
LVD or PVD No
DMA No
Ethernet No
USB USB Peripheral
Temp. Range -40 to +85°C
Family Name H8S
Lead Compliant Yes
Length (mm) 10
MOQ 1
Pb (Lead) Free Yes
Pkg. Dimensions (mm) 10 x 10 x 1.4
Pkg. Type LFBGA
Tape & Reel No
Thickness (mm) 1.4
Width (mm) 10

描述

The H8S/2218 Group is supported only for customers who have already adopted these products. The RX231, RX651 Groups are recommended for new designs.