Lead Count (#) | 52 |
Pkg. Code | pkg_712 |
Pkg. Type | LQFP |
Pkg. Dimensions (mm) | 10 x 10 x 1.7 |
ECCN (US) | 3A991 |
HTS (US) | 9999.99.9999 |
RoHS (R5F21257SDFP#X6) | 英语日文 |
Moisture Sensitivity Level (MSL) | 3 |
Pb (Lead) Free | Yes |
RAM (KB) | 2.5 |
Lead Count (#) | 52 |
Temp. Range | -40 to +85°C |
Country of Assembly | China |
Country of Wafer Fabrication | Japan |
ADC | 10-bit x 12-ch |
Bit Size | 16 |
CPU | R8C |
Carrier Type | Tape & Reel |
DMA | No |
Data Flash (KB) | 2 |
Ethernet | No |
Family Name | R8C |
I/O Ports | 41 |
LVD or PVD | Yes |
Lead Compliant | Yes |
Length (mm) | 10 |
MOQ | 1500 |
Moisture Sensitivity Level (MSL) | 3 |
Operating Freq (Max) (MHz) | 20 |
Pb (Lead) Free | Yes |
Pkg. Dimensions (mm) | 10 x 10 x 1.7 |
Pkg. Type | LQFP |
Program Memory (KB) | 48 |
RTC | Yes |
Supply Voltage (V) | 2.2 - 5.5 |
Tape & Reel | No |
Thickness (mm) | 1.7 |
Timer | 8-bit x 3-ch, 16-bit x 2-ch |
Width (mm) | 10 |
The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/25 Group has on-chip data flash (1KB x 2 blocks). The difference between the R8C/24 Group and R8C/25 Group is only the presence or absence of data flash. Their peripheral functions are the same.