跳转到主要内容

Renesas Electronics Reaches a Definitive Agreement to Transfer its Subsidiaries' Back-End Facilities and Others to J-Devices

2013年3月19日

TOKYO, Japan, March 19, 2013 — Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today announced that Renesas and J-Devices Corporation (“J-Devices”) signed a definitive agreement (“DA”) to transfer Renesas subsidiaries' back-end facilities and others to J-Devices following a Memorandum of Understanding which was announced on January 30, 2013 in the news release “Renesas Electronics and J-Devices Sign Memorandum of Understanding on Transfer of Back-End Facilities”.

 

In this transfer, Renesas defines its wholly owned subsidiaries, Renesas Northern Japan Semiconductor, Inc. (“Renesas Northern Japan”), Renesas Kansai Semiconductor Co., Ltd. (“SKS”), Renesas Kyushu Semiconductor Corp. (“Renesas Kyushu”) and Renesas Northern Japan's wholly owned subsidiary, Hokkai Electronics Co., Ltd. (“Hokkai Electronics”) as “splitting companies in absorption-type split”. Through an absorption-type corporate split (“the corporate split”) Renesas will transfer assets, debts, other rights and obligations related to partial back-end production business of the splitting companies in absorption-type split (back-end production business of the Hakodate Factory of Renesas Northern Japan and the Fukui Factory of SKS, back-end production business and contract manufacturing service of the Kumamoto Factory of Renesas Kyushu, and production support business of Hokkai Electronics: referred to collectively below as “the business to be transferred”) to a wholly owned subsidiary that Renesas will newly establish. Then Renesas will transfer all issued shares of the subsidiary to J-Devices (This transfer is referred to below as “the transfer”).

 

The DA aims at building a long-term, mutually beneficial relationship between Renesas and J-Devices as strategic partners in the semiconductor production business. With today's agreement as the basis, the two companies intend to complete the transfer on June 1, 2013.

 

I. Purpose of the Corporate Split and the Transfer

As announced on July 3, 2012, in “Renesas Electronics Announces the Direction of Various Measures to Establish Robust and Profitable Structure”, Renesas is proceeding with the restructuring of Renesas group production facilities in Japan in order to strengthen its revenue base. As part of this process, under a production strategy in which the back-end facilities in Japan specialize in production of high-value added products with increasing outsourcing ratio as well as production ratio at Renesas overseas sites as a result, the Yonezawa Factory of Renesas Northern Japan and the Oita Factory of Renesas Semiconductor Kyushu Yamaguchi Co., Ltd. were to be maintained and strengthened, and the business to be transferred this time were to be “considered for transfer within one year” in a process of selection and focus of business operations. Accordingly, Renesas began looking for a transfer assignee with whom it could expect to build a long-term partnership that would strengthen the competitiveness of the business to be transferred and provide a high-quality, reliable supply of products.

 

On the other hand, as a company devoted to semiconductor assembly and test operations for customers, J-Devices believed it is of the utmost importance to expand the scale of its operation in order to strengthen cost competitiveness required for the further business growth.

 

Against this background, Renesas and J-Devices came to a common understanding, and reached the DA regarding the business to be transferred to J-Devices on June 1, 2013.

 

The Renesas products, which are related to the business to be transferred, will continue to be supplied by Renesas to customers with the quality, delivery schedules, service equal to or better than before even after the transfer.

 

As previously mentioned, Renesas will transfer assets, debts, other rights and obligations related to the business to be transferred to a wholly owned subsidiary that Renesas will newly establish. Then Renesas will transfer all issued shares of the subsidiary to J-Devices. The overview of the subsidiary is as follows.

 

II. Establishment of the Subsidiary

1. Purpose of the Establishment of the Subsidiary (Successor Company in Absorption-Type Split)

As part of the transfer, Renesas intends to integrate the business to be transferred into Renesas J Semiconductor Corporation (“successor company in absorption-type split”), which Renesas will newly establish as its wholly owned subsidiary.

 

2. Overview of the Subsidiary to be Established in April 2013 as a Successor Company in Absorption-Type Split

Company NameRenesas J Semiconductor Corporation
Location2-6-2, Ote-machi, Chiyoda-ku, Tokyo 100-0004, Japan
RepresentativeAkira Furuki, Representative Director and President
Major OperationsResearch, development, design, manufacture and sale of electronic products
Capital1 million yen

III. The Corporate Split

1. Outline of the Corporate Split

  • (1) Timeline for the Corporate Split
    • Approval of the splitting companies in absorption-type split for the corporate split agreement: April 2013 (planned)
    • Approval of the successor company in absorption-type split for the corporate split agreement: April 2013 (planned)
    • Signing of the corporate split agreement: April 2013 (planned)
    • Approval of shareholders' meetings of the splitting companies in absorption-type split for the corporate split: May 2013 (planned)
    • Approval of shareholders' meeting of the successor company in absorption-type split for the corporate split: May 2013 (planned)
    • Effective date of the corporate split: June 1, 2013 (planned)
  • (2) Method of the Corporate Split

    Renesas Northern Japan, SKS, Renesas Kyushu and Hokkai Electronics will be the splitting companies in absorption-type split and Renesas J Semiconductor Corporation will be the successor company in absorption-type split.

  • (3) Share Allocation in Accordance with the Corporate Split

    <Corporate split of Renesas Kyushu>

    Upon the corporate split, the successor company in absorption-type split will issue 3,000 common stocks and will allocate all of them to Renesas Kyushu, a splitting company in absorption-type split. In addition, Renesas Kyushu will allocate all the shares as dividend of surplus to its wholly owning parent company, Renesas.

    <Corporate split of other three companies (Renesas Northern Japan, SKS, and Hokkai Electronics)>

    Upon the corporate split, allocation of shares, cash and other property is not scheduled.


  • (4) Share Subscription Rights and Bonds with Share Subscription Rights

    The splitting companies in absorption-type split have not issued share subscription rights and bonds with share subscription rights.

  • (5) Rights and Obligations Transferred to the Successor Company

    Capital of the splitting companies in absorption-type split will not be changed following the corporate split while capital of the successor company in absorption-type split will be increased by 300 million yen resulting from the corporate split of Renesas Kyushu.

  • (6)Rights and Obligations Transferred to the Successor Company

    The successor company in absorption-type split will acquire assets, debts, other rights and obligations of the business to be transferred on the effective date of the corporation split based on the corporate split agreement with the splitting companies in absorption-type split. The transfer will be undertaken with the method of noncumulative taking of obligation.

  • (7)Ability to Fulfill Obligations

    Renesas concludes that both the splitting companies and the successor company in absorption-type split shall have abilities to fulfill all their debt obligations on and after the effective date of the corporate split.

2. Overview of the Splitting Companies and the Successor Company

  Splitting Company 1Successor Company
(1)Company NameRenesas Northern Japan Semiconductor, Inc.Renesas J Semiconductor Corporation
(2)Location145, Aza-Nakajima, Nanae-cho, Kameda-gun, Hokkaido, 041-1196, Japan2-6-2, Ote-machi, Chiyoda-ku, Tokyo 100-0004, Japan
(3)RepresentativeKosuke Tanaka, Representative Director and PresidentAkira Furuki, Representative Director and President
(4)Major OperationsResearch, development, design, manufacture and sale of semiconductor and IC productsResearch, development, design, manufacture and sale of electronic products
(5)Capital2,550 million yen1 million yen
(6)EstablishedMay 30, 1970April, 2013 (planned)
(7)Number of Shares Issued6,648,000
(8)Fiscal TermMarch 31March 31
(9)Employees
(10)Main Client
(11)Main Bank
(12)Major Shareholders and Equity RatioRenesas Electronics Corporation 100%Renesas Electronics Corporation 100%
(13)The financial results and financial position of the splitting company for the past three years
Accounting PeriodFiscal year ended March 2010Fiscal year ended March 2011Fiscal year ended March 2012
 Net Asset9,380 million yen9,827 million yen8,031 million yen
 Total Asset31,335 million yen30,421 million yen31,117 million yen
 Net Asset Per Share1,410.88 yen1,478.16 yen1,208.06 yen
 Net Sales44,318 million yen48,562 million yen41,536 million yen
 Operating Income1,162 million yen2,143 million yen-814 million yen
 Ordinary Income1,043 million yen2,064 million yen-885 million yen
 Net Income1,901 million yen447 million yen-1,796 million yen
 Net Income Per Share285.94 yen67.27 yen-270.09 yen
 Dividends Per Share
  Splitting Company 2Successor Company
(1)Company NameRenesas Kansai Semiconductor Co., Ltd.Renesas J Semiconductor Corporation
(2)Location2-9-1 Seiran, Otsu-shi, Shiga 520-8555, Japan2-6-2, Ote-machi, Chiyoda-ku, Tokyo 100-0004, Japan
(3)RepresentativeYasuhiro Funakoshi, Representative Director and PresidentAkira Furuki, Representative Director and President
(4)Major OperationsResearch, development, design, manufacture and sale of semiconductor and IC productsResearch, development, design, manufacture and sale of electronic products
(5)Capital1,000 million yen1 million yen
(6)EstablishedJuly 1, 1983April, 2013 (planned)
(7)Number of Shares Issued20,000
(8)Fiscal TermMarch 31March 31
(9)Employees
(10)Main Client
(11)Main Bank
(12)Major Shareholders and Equity RatioRenesas Electronics Corporation 100%Renesas Electronics Corporation 100%
(13)The financial results and financial position of the splitting company for the past three years
Accounting PeriodFiscal year ended March 2010Fiscal year ended March 2011Fiscal year ended March 2012
 Net Asset1,871 million yen1,866 million yen560 million yen
 Total Asset56,987 million yen53,309 million yen45,524 million yen
 Net Asset Per Share93,555.32 yen93,312.14 yen28,016.53 yen
 Net Sales85,991 million yen68,065 million yen55,121 million yen
 Operating Income7,641 million yen1,547 million yen582 million yen
 Ordinary Income6,540 million yen184 million yen-639 million yen
 Net Income3,584 million yen-3.7 million yen-1,307 million yen
 Net Income Per Share179,219.92 yen-185.74 yen-65,325.00 yen
 Dividends Per Share
  Splitting Company 3Successor Company
(1)Company NameRenesas Kyushu Semiconductor Corp.Renesas J Semiconductor Corporation
(2)Location272-10, Oaza-Takaono, Ozu-machi, Kikuchi-gun, Kumamoto, 869-1232, Japan2-6-2, Ote-machi, Chiyoda-ku, Tokyo 100-0004, Japan
(3)Representative DirectorAkira Furuki, Representative Director and PresidentAkira Furuki, Representative Director and President
(4)Major OperationsResearch, development, design, manufacture and sale of semiconductor and IC productsResearch, development, design, manufacture and sale of electronic products
(5)Capital500 million yen1 million yen
(6)EstablishedAugust 1, 1991April, 2013 (planned)
(7)Number of Shares Issued7,000
(8)Fiscal TermMarch 31March 31
(9)Employees
(10)Main Client
(11)Main Bank
(12)Major Shareholders and Equity RatioRenesas Electronics Corporation 100%Renesas Electronics Corporation 100%
(13)The financial results and financial position of the splitting company for the past three years
Accounting PeriodFiscal year ended March 2010Fiscal year ended March 2011Fiscal year ended March 2012
 Net Asset1,494 million yen1,747 million yen1,124 million yen
 Total Asset20,863 million yen22,012 million yen18,232 million yen
 Net Asset Per Share213,396.76 yen249,618.47 yen160,634.74 yen
 Net Sales31,506 million yen30,890 million yen24,791 million yen
 Operating Income471 million yen572 million yen-348 million yen
 Ordinary Income367 million yen468 million yen-493 million yen
 Net Income241 million yen253 million yen-623 million yen
 Net Income Per Share34,447.75 yen36,221.71 yen-88,983.73 yen
 Dividends Per Share
  Splitting Company 4Successor Company
(1)Company NameHokkai Electronics Co., Ltd.Renesas J Semiconductor Corporation
(2)Location289-12, Higashi-cho, Yakumo-cho, Futami-gun, Hokkaido, 049-3102, Japan2-6-2, Ote-machi, Chiyoda-ku, Tokyo 100-0004, Japan
(3)RepresentativeKeiichi Nakamura, Representative Director and PresidentAkira Furuki, Representative Director and President
(4)Major OperationsManufacture and sale of IC productsResearch, development, design, manufacture and sale of electronic products
(5)Capital20 million yen1 million yen
(6)EstablishedNovember 2, 1978April, 2013 (planned)
(7)Number of Shares Issued400
(8)Fiscal TermMarch 31March 31
(9)Employees
(10)Main Client
(11)Main Bank
(12)Major Shareholders and Equity RatioRenesas Northern Japan Semiconductor, Inc. 100%Renesas Electronics Corporation 100%
(13)The financial results and financial position of the splitting company for the past three years
Accounting PeriodFiscal year ended March 2010Fiscal year ended March 2011Fiscal year ended March 2012
 Net Asset62 million yen70 million yen75 million yen
 Total Asset215 million yen210 million yen198 million yen
 Net Asset Per Share156,517.50 yen175,405.00 yen188,185.00 yen
 Net Sales308 million yen310 million yen262 million yen
 Operating Income13 million yen20 million yen18 million yen
 Ordinary Income16 million yen20 million yen16 million yen
 Net Income3 million yen7 million yen5 million yen
 Net Income Per Share8,139.99 yen18,888.64 yen12,779.84 yen
 Dividends Per Share

 

3. Overview of the Business to be Carved out through the Corporate Split

(1) Business to be Carved out

Hakodate Factory of Renesas Northern Japan: Semiconductor back-end production business Fukui Factory of SKS: Semiconductor back-end production business Kumamoto Factory of Renesas Kyushu: Semiconductor back-end production business and contract manufacturing service Hokkai Electronics: Support business of semiconductor back-end production

(2) Financial Results of Divisions to be Carved out

A. Hakodate Factory of Renesas Northern Japan

 Fiscal year ended March 2011Fiscal year ended March 2012
Sales*25,782 million yen30,960 million yen

B. Fukui Factory of SKS

 Fiscal year ended March 2011Fiscal year ended March 2012
Sales*35,017 million yen25,422 million yen

C. Kumamoto Factory of Renesas Kyushu

 Fiscal year ended March 2011Fiscal year ended March 2012
Sales*50,208 million yen56,293 million yen

D. Hokkai Electronics

 Fiscal year ended March 2011Fiscal year ended March 2012
Sales*310 million yen262 million yen

*Above sales include the value of chips and others which Renesas provides to each splitting company