瑞萨电子 (Renesas Electronics Corporation)
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YGG1 (Module 22)

文档标题 信息
Pkg. Name
Name used to describe Renesas packages.
 Y22.15X15
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 YGG1
Package Description
Descriptive text for this package.
 Special 22 I/O 15mm x15 mm Custom HDA Module with G770HJ for eng
Package Status
 Active
Package Type
 Module
Package Code
The unique identifier of this package.
 YGG1
分类
 PLASTIC
Lead Count
 22
Pb (Lead) Free
 Yes
长度
 15mm
宽度
 15mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 3.6mm
Pitch
 1mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 15.00 x 15.00 x 3.60