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3.3V 256K x 36 Synchronous 3.3V I/O PipeLined SRAM

封装信息

Lead Count (#) 165
Pkg. Code BQG165
Pitch (mm) 1
Pkg. Type CABGA
Pkg. Dimensions (mm) 15.0 x 13.0 x 1.2

环境和出口类别

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US) NLR
HTS (US) 8542320041

产品属性

Lead Count (#) 165
Pb (Lead) Free Yes
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Price (USD) | 1ku 21.76963
Architecture Synch Burst
Bus Width (bits) 36
Core Voltage (V) 3.3
Density (Kb) 9216
I/O Frequency (MHz) 1 - 1
I/O Voltage (V) 3.3 - 3.3
Length (mm) 15.0
MOQ 272
Organization 256K x 36
Output Type Pipelined
Package Area (mm²) 195.0
Pb Free Category e1 SnAgCu
Pitch (mm) 1.0
Pkg. Dimensions (mm) 15.0 x 13.0 x 1.2
Pkg. Type CABGA
Qty. per Carrier (#) 136
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range 0 to 70°C
Thickness (mm) 1.2
Width (mm) 13.0

描述

The 71V67603 3.3V CMOS SRAM is organized as 256K x 36. The 71V67603 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.The order of these three addresses are defined by the internal burst counter and the LBO input pin.