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3.3V 512K x 18 Synchronous 3.3V I/O Flow-Through SRAM

封装信息

Lead Count (#) 119
Pkg. Code BG119
Pitch (mm) 1.27
Pkg. Type PBGA
Pkg. Dimensions (mm) 14.0 x 22.0 x 2.15

环境和出口类别

Pb (Lead) Free No
Moisture Sensitivity Level (MSL) 3
ECCN (US) NLR
HTS (US) 8542320041

产品属性

Lead Count (#) 119
Pb (Lead) Free No
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Architecture Synch Burst
Bus Width (bits) 18
Core Voltage (V) 3.3
Density (Kb) 9216
I/O Voltage (V) 3.3 - 3.3
Length (mm) 14.0
MOQ 252
Organization 512K x 18
Output Type Flowthrough
Package Area (mm²) 308.0
Pb Free Category e0
Pitch (mm) 1.27
Pkg. Dimensions (mm) 14.0 x 22.0 x 2.15
Pkg. Type PBGA
Qty. per Carrier (#) 84
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range 0 to 70°C
Thickness (mm) 2.15
Width (mm) 22.0

描述

The 71V67903 3.3V CMOS SRAM is organized as 512K x 18. The 71V67903 SRAM contains write, data, address and control registers. There are no registers in the data output path (flow-through architecture). The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.