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128K x 18 / 256K x 9 TeraSync FIFO, 2.5V

封装信息

CAD 模型:View CAD Model
Pkg. Type:PBGA
Pkg. Code:BB240
Lead Count (#):240
Pkg. Dimensions (mm):19.0 x 19.0 x 1.76
Pitch (mm):1

环境和出口类别

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

产品属性

Lead Count (#)240
Pb (Lead) FreeNo
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)2.5
Density (Kb)2048
Family NameTeraSync
FunctionBus Matching, JTAG, Mark & Retransmit
I/O Frequency (MHz)100 - 100
I/O Type1.5 V HSTL, 1.8 V HSTL, 2.5 V LVTTL, 3.3 V LVTTL
InterfaceSynchronous
Length (mm)19
MOQ25
Organization128K x 18, 256K x 9
Package Area (mm²)361
Pb Free Categorye0
Pitch (mm)1
Pkg. Dimensions (mm)19.0 x 19.0 x 1.76
Pkg. TypePBGA
Price (USD)$135.9928
Qty. per Carrier (#)84
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.76
Width (mm)19
已发布No

描述

The 72T18105 is a 128K x 18 / 256K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.