跳转到主要内容
256K x 36 TeraSync FIFO, 2.5V

封装信息

CAD 模型:View CAD Model
Pkg. Type:PBGA
Pkg. Code:BB240
Lead Count (#):240
Pkg. Dimensions (mm):19.0 x 19.0 x 1.76
Pitch (mm):1

环境和出口类别

Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0071
Pb (Lead) FreeNo

产品属性

Lead Count (#)240
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyPHILIPPINES
Country of Wafer FabricationTAIWAN, UNITED STATES
ArchitectureUni-directional
Bus Width (bits)36
Core Voltage (V)2.5
Density (Kb)9216
Family NameTeraSync
FunctionBus Matching, JTAG, Mark & Retransmit
I/O Frequency (MHz)200 - 200
I/O Type1.5 V HSTL, 2.5 V LVTTL, 3.3 V LVTTL
InterfaceSynchronous
Length (mm)19
MOQ25
Organization256K x 36
Package Area (mm²)361
Pb (Lead) FreeNo
Pb Free Categorye0
Pitch (mm)1
Pkg. Dimensions (mm)19.0 x 19.0 x 1.76
Pkg. TypePBGA
Price (USD)$315.8148
Qty. per Carrier (#)84
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.76
Width (mm)19
已发布No

描述

The 72T36125 is a 256K x 36 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x36/x18/x9 data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.