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4K x 18 / 8K x 9 SuperSync II FIFO, 3.3V

封装信息

Lead Count (#) 80
Pkg. Code PNG80
Pitch (mm) 0.65
Pkg. Type TQFP
Pkg. Dimensions (mm) 14.0 x 14.0 x 1.4

环境和出口类别

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US) NLR
HTS (US) 8542320071

产品属性

Lead Count (#) 80
Pb (Lead) Free Yes
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Country of Assembly Philippines
Country of Wafer Fabrication Taiwan, United States
Price (USD) | 1ku 53.1381
Architecture Uni-directional
Bus Width (bits) 18
Core Voltage (V) 3.3
Density (Kb) 72
Family Name SuperSync II
Function Bus Matching, JTAG
I/O Frequency (MHz) 1 - 1
I/O Type 3.3 V LVTTL
Interface Synchronous
Length (mm) 14
MOQ 100
Organization 4K x 18, 8K x 9
Package Area (mm²) 196.0
Pb Free Category e3 Sn
Pitch (mm) 0.65
Pkg. Dimensions (mm) 14.0 x 14.0 x 1.4
Pkg. Type TQFP
Qty. per Carrier (#) 90
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range -40 to 85°C
Thickness (mm) 1.4
Width (mm) 14

描述

The 72V253 8K x 9/4K x 18 SuperSync II FIFO memory has flexible x9/x18 bus-matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.