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64K x 18 / 128K x 9 SuperSync II FIFO, 3.3V

封装信息

CAD 模型:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PNG80
Lead Count (#):80
Pkg. Dimensions (mm):14.0 x 14.0 x 1.4
Pitch (mm):0.65

环境和出口类别

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0071

产品属性

Lead Count (#)80
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyPHILIPPINES
Country of Wafer FabricationTAIWAN, UNITED STATES
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)1024
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)133 - 133
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)14
MOQ45
Organization128K x 9, 64K x 18
Package Area (mm²)196
Pb Free Categorye3 Sn
Pitch (mm)0.65
Pkg. Dimensions (mm)14.0 x 14.0 x 1.4
Pkg. TypeTQFP
Price (USD)$146.566
Qty. per Carrier (#)90
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.4
Width (mm)14
已发布No

描述

The 72V293 128K x 9/64K x 18 SuperSync II FIFO memory has flexible x9/x18 bus-matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.