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4K x 36 SuperSync II FIFO, 3.3V

封装信息

CAD 模型:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PKG128
Lead Count (#):128
Pkg. Dimensions (mm):20.0 x 14.0 x 1.4
Pitch (mm):0.5

环境和出口类别

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0071

产品属性

Lead Count (#)128
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN, UNITED STATES
ArchitectureUni-directional
Bus Width (bits)36
Core Voltage (V)3.3
Density (Kb)144
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)166 - 166
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)20
MOQ104
Organization4K x 36
Package Area (mm²)280
Pb Free Categorye3 Sn
Pitch (mm)0.5
Pkg. Dimensions (mm)20.0 x 14.0 x 1.4
Pkg. TypeTQFP
Price (USD)$81.92846
Qty. per Carrier (#)72
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)14
已发布No

描述

The 72V3660 4K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible bus-matching x36/x18/x9 data flow and asynchronous/synchronous translation on the read or write ports. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.