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IO-Link Device Transceiver with Cost-Optimized Feature Set

封装信息

Pkg. Type: DFN10
Pkg. Code:
Lead Count (#): 10
Pkg. Dimensions (mm): 3.0 x 3.0 x 0.75
Pitch (mm): 0.5

环境和出口类别

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

产品属性

Lead Count (#) 10
Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
Temp. Range (°C) -40 to +125°C
Country of Assembly Taiwan
Country of Wafer Fabrication Malaysia
Advanced Features 3.3V and 5V LDO options, Embedded reverse polarity and overcurrent protection, Automatic recovery
Budgetary Price (100u) (USD) 2.18
Budgetary Price (1ku) (USD) 1.8
Budgetary Price (1u) (USD) 2.9
Channels (#) 1
MOQ 5000
Pitch (mm) 0.5
Pkg. Dimensions (mm) 3.0 x 3.0 x 0.75
Pkg. Type DFN10
Qty. per Reel (#) 5000
Supply Voltage (V) 7 - 36

描述

The CCE4503 is an easy-to-use device-side IO-Link compliant transceiver. It combines IO-Link compliant communication capability with advanced protection circuitry and additional features while keeping the application small and simple.

Controlled by a UART interface (TXD, RXD, TXEN), the output drivers can be configured as PNP, NPN or Push-Pull. Three LDO options and an automatic wake-up detection simplify the overall system requirements and reduce the need for additional external circuitry. The integrated protection features such as reverse-polarity protection, overcurrent protection, undervoltage detection, and thermal protection ensure robust functionality and communication.

With the small 3mm x 3mm DFN10 package size, it is especially suitable for space-limited sensor and actuator applications.

The CCE4503 IO-Link Device Transceiver is suitable for IO-Link device applications and is compliant with the IO-Link interface and system specification Version 1.1.2 from July 2013, accessible via www.io-link.org.

For a complete end-to-end system solution, Renesas also provides the CCE4510 two-channel IO-Link Master Transceiver.

Benefits

  • All IO-Link frame types supported
  • Optimized feature set for best in market cost-efficiency
  • Improved protection features
  • Low power dissipation
  • Minimal need for external circuitry
  • Especially suitable for space-constricted applications