封装信息
| Pitch (mm) | 2.54 |
| Lead Count (#) | 14 |
| Pkg. Type | SBDIP |
| Pkg. Dimensions (mm) | 19.00 x 7.37 x 2.41 |
| Pkg. Code | HSG |
环境和出口类别
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Exempt |
| ECCN (US) | 3A001 |
| HTS (US) |
产品属性
| Pkg. Type | SBDIP |
| Lead Count (#) | 14 |
| Carrier Type | Tube |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pitch (mm) | 2.5 |
| Pkg. Dimensions (mm) | 19.0 x 7.4 x 2.41 |
| DLA SMD | 5962R9665301VCC |
| Pb (Lead) Free | Exempt |
| Pb Free Category | Gold Plate over compliant Undercoat-e4 |
| MOQ | 25 |
| Temp. Range | -55 to +125°C |
| DSEE (MeV·cm2/mg) | 75 |
| Length (mm) | 19 |
| Qualification Level | QML Class V (space) |
| Rating | Space |
| TID HDR (krad(Si)) | 100 |
| TID LDR (krad(Si)) | ELDRS free |
| Thickness (mm) | 2.41 |
| Width (mm) | 7.4 |
描述
The CD4069UBMS CMOS hex inverters consist of six CMOS inverter circuits. These devices are intended for all general-purpose inverter applications where the medium-power TTL-drive and logic level conversion capabilities of circuits such as the CD4009 and CD4049 hex inverter/buffers are not required. The CD4069UBMS is supplied in these 14-lead outline packages: Braze Seal DIP H4H, Frit Seal DIP H1B and Ceramic Flatpack H3W.