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SmartBond Bluetooth Low Energy Solution for A4WP and HCI Applications

封装信息

Pkg. Dimensions (mm) 2.5 x 2.5 x 0.5
Pitch (mm) 0.4
Pkg. Type WLCSP34

环境和出口类别

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.39.90

产品属性

Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 1
Pkg. Dimensions (mm) 2.5 x 2.5 x 0.5
GPIOs (#) 14
Pb (Lead) Free Yes
Country of Assembly Taiwan
Country of Wafer Fabrication Taiwan
Price (USD) | 1ku 2.77788
Application Host Controller Interface, Wireless Charging
CPU M0
Clock Rate (MHz) 16
Execute from FLASH No
Flexible System Clock No
Hardware Crypto Engine Yes
MCU/MPU M0
MOQ 5000
Memory Size (OTP) (KB) 32
Operating Freq (Max) (MHz) 32
Pitch (mm) 0.4
Pkg. Type WLCSP34
Qty. per Reel (#) 5000
RAM (KB) 50
ROM (KB) 84
Recommended for new Designs No
Rx current (mA) 5.1
SPI (#) 1
Sensitivity (dBm) (dBm) -93
Supply Voltage Vcc Range 0.9-3.6
Temp. Range -40 to +85°C
Tx Current (mA) 4.8
UART (#) 1
Wireless Standard BLE 4.2 Core specification

描述

The DA14581 integrated circuit is an optimized version of the DA14580, offering a reduced boot time and supporting up to 8 connections. It has a fully integrated radio transceiver and baseband processor for Bluetooth® Low Energy. It can be used as a standalone application processor or as a data pump in hosted systems.

The DA14581 supports a flexible memory architecture for storing Bluetooth profiles and custom application code, which can be updated Over-the-Air (OTA). The qualified Bluetooth Low Energy protocol stack and the HCI-ready software are stored in a dedicated Read-Only Memory (ROM). All software runs on the Arm® Cortex®-M0 processor via a simple scheduler.

The Bluetooth Low Energy firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The transceiver interfaces directly to the antenna and is fully compliant with the Bluetooth 4.2 standard.

The DA14581 has dedicated hardware for the Link Layer implementation of Bluetooth Low Energy and interface controllers for enhanced connectivity capabilities.

Benefits

  • Based on the same outstanding DA14580 SoC
  • Uses a dedicated ROM which offers optimizations targeting A4WP and HCI
  • Alliance for Wireless Power (A4WP)
    • Fast boot time for Power Receiving Unit (PRU)
    • 8 connections for Power Transmitting Unit (PTU)
  • Human-Computer Interaction (HCI)
    • Optimized code for HCI which fits into the OTP
    • This enables customers/modules to provide a pre-programmed HCI device/module

Packages

  • WLCSP-34 (2.5mm x 2.5mm x 0.5mm)
  • QFN-40 (5.0mm x 5.0mm x 0.9mm)
  • Ultra-thin WLCSP-34 (2.436mm x 2.436mm x 0.334mm)