跳转到主要内容
SmartBond Bluetooth Low Energy 5.0 SoC with Enhanced Security

封装信息

CAD 模型:View CAD Model
Pkg. Type:AQFN
Pkg. Code:
Lead Count (#):60
Pkg. Dimensions (mm):6 x 6 x 0.8
Pitch (mm):0.55

环境和出口类别

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
RoHS (DA14683-00000A92)下载
ECCN (US)
HTS (US)

产品属性

Lead Count (#)60
Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)3
Pitch (mm)0.55
Pkg. Dimensions (mm)6 x 6 x 0.8
Qty. per Reel (#)4000
Pb (Lead) FreeYes
Temp. Range (°C)-40 to +85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
2MbpsNot Supported
ADC10-bit x 8-ch
AoANot Supported
AoDNot Supported
ApplicationRechargeable devices, Banking, Industrial, USB-to-BLE dongles
Bluetooth® MeshOn request
CPUM0
Clock Rate (MHz)96
Execute from FLASHYes
Extended AdvertisingNot Supported
External Rails and Load Capacity3.3V @ 100mA, 1.4V @ 20mA, 1.2V @ 50mA, 1.8V @ 75mA
Flash Memory (KB)0
Flexible System ClockYes
GATT CachingNot Supported
GPIOs (#)37
Hardware Crypto EngineYes
I2C (#)2
Integrated Battery ChargerYes, 400mA USB charger
Integrated DCDCSIMO Buck DC-DC converter
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
Longevity2033 9月
MCU/MPUM0
MOQ4000
Memory Size (OTP) (KB)64
Operating Freq (Max) (MHz)96
Output Power Range (dBm)0 - 0
Periodic AdvertisingNot Supported
Pkg. TypeAQFN
Price (USD)$5.12225
Proprietary 2G4 protocolNo
QSPI Interface (#)1
RAM (KB)128
ROM (KB)128
Recommended for new DesignsYes
Rx current (mA)3.1
SPI (#)2
Sensitivity (dBm) (dBm)-94
Supply Voltage Vcc Range1.7-4.75
Tx Current (mA)3.4
UART (#)2
USB Ports (#)1
Wireless StandardBLE 5.0 Core specification
已发布Yes

描述

The SmartBond™ DA14683 is one of the world's first single-chip solutions for smart home, industrial and wearable devices that meets the enhanced security standards. These highly integrated System-on-Chip (SoC) devices support Bluetooth® 5 and include a range of dedicated features to ensure cutting-edge security for both consumers and developers.

The DA14683 comes with enhanced security features such as key manipulation, secure booting (i.e. starting the system only if the Flash image is authenticated), a complete public/private hardware acceleration engine and a hardware true random number generator (TRNG).

As part of our SmartBond range, the SoC offers industry-leading performance from the lowest power consumption and smallest footprint. Its flexible architecture ensures plenty of processing capacity when you need it while saving power when you don't. It also allows the device to manage multi-sensor arrays and enables always-on sensing.

The device offers extensive memory capacity. The DA14683 supports unlimited external Flash for maximum design flexibility . And, the device allows users to benefit from Over-the-Air (OTA) updates.

To further simplify development, our SmartSnippets™ software and versatile hardware development kits help users optimize their software for power consumption.

Benefits

  • Enhanced security
  • IPv6 connectivity
  • Lowest system power
  • Lowest system BOM
  • Smallest system size

Packages

  • AQFN-60 (6.0mm x 6.0mm x 0.9mm)
  • WLCSP-53 (3.4mm x 3.0mm x 0.5mm)