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SmartBond Bluetooth Low Energy 5.0 SoC with Enhanced Security

封装信息

Pitch (mm) 0.4
Lead Count (#) 53
Pkg. Dimensions (mm) 3.4 x 3.0 x 0.5
Pkg. Type WLCSP

环境和出口类别

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.39.90

产品属性

Lead Count (#) 53
Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 1
Pitch (mm) 0.4
Pkg. Dimensions (mm) 3.4 x 3.0 x 0.5
Qty. per Reel (#) 5000
Pb (Lead) Free Yes
Temp. Range -40 to +85°C
Country of Assembly Taiwan
Country of Wafer Fabrication Taiwan
Price (USD) | 1ku 4.61727
2Mbps Not Supported
ADC 10-bit x 8-ch
AoA Not Supported
AoD Not Supported
Application Rechargeable devices, Banking, Industrial, USB-to-BLE dongles
Bluetooth® Mesh On request
CPU M0
Clock Rate (MHz) 96
Execute from FLASH Yes
Extended Advertising Not Supported
External Rails and Load Capacity 3.3V @ 100mA, 1.4V @ 20mA, 1.2V @ 50mA, 1.8V @ 75mA
Flash Memory (KB) 0
Flexible System Clock Yes
GATT Caching Not Supported
GPIOs (#) 21
Hardware Crypto Engine Yes
I2C (#) 2
Integrated Battery Charger Yes, 400mA USB charger
Integrated DCDC SIMO Buck DC-DC converter
LE Coded PHY (Long Range) Not Supported
LE Data Length Extensions Supported
Longevity 2033 9月
MCU/MPU M0
MOQ 5000
Memory Size (OTP) (KB) 64
Operating Freq (Max) (MHz) 96
Output Power Range (dBm) 0 - 0
Periodic Advertising Not Supported
Pkg. Type WLCSP
Proprietary 2G4 protocol No
QSPI Interface (#) 1
RAM (KB) 128
ROM (KB) 128
Recommended for new Designs Yes
Rx current (mA) 3.1
SPI (#) 2
Sensitivity (dBm) (dBm) -94
Supply Voltage Vcc Range 1.7-4.75
Tx Current (mA) 3.4
UART (#) 2
USB Ports (#) 1
Wireless Standard BLE 5.0 Core specification

描述

The SmartBond™ DA14683 is one of the world's first single-chip solutions for smart home, industrial and wearable devices that meets the enhanced security standards. These highly integrated System-on-Chip (SoC) devices support Bluetooth® 5 and include a range of dedicated features to ensure cutting-edge security for both consumers and developers.

The DA14683 comes with enhanced security features such as key manipulation, secure booting (i.e. starting the system only if the Flash image is authenticated), a complete public/private hardware acceleration engine and a hardware true random number generator (TRNG).

As part of our SmartBond range, the SoC offers industry-leading performance from the lowest power consumption and smallest footprint. Its flexible architecture ensures plenty of processing capacity when you need it while saving power when you don't. It also allows the device to manage multi-sensor arrays and enables always-on sensing.

The device offers extensive memory capacity. The DA14683 supports unlimited external Flash for maximum design flexibility . And, the device allows users to benefit from Over-the-Air (OTA) updates.

To further simplify development, our SmartSnippets™ software and versatile hardware development kits help users optimize their software for power consumption.

Benefits

  • Enhanced security
  • IPv6 connectivity
  • Lowest system power
  • Lowest system BOM
  • Smallest system size

Packages

  • AQFN-60 (6.0mm x 6.0mm x 0.9mm)
  • WLCSP-53 (3.4mm x 3.0mm x 0.5mm)