跳转到主要内容
SmartBond 低功耗蓝牙 5.2 高集成度(包括 USB 充电器)模块

封装信息

Lead Count (#) 84
Pkg. Type MODULE
Pitch (mm) 1.5
Pkg. Dimensions (mm) 15.85 x 20 x 2.5

环境和出口类别

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

产品属性

Pkg. Type MODULE
Lead Count (#) 84
Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 3
Qty. per Reel (#) 100
Pb (Lead) Free Yes
Temp. Range (°C) -40 to +85°C
Price (USD) 14.5862
Country of Assembly Thailand
2Mbps Supported
ADC 10-bit x 4-ch, 14-bit x 4-ch
AoA Supported
AoD TX Supported
Application Rechargeable devices, HMI, ATLAS, Asset tracking, Connected health, Proximity tags & trackers
Bluetooth® Mesh Not Supported
Budgetary Price (100u) (USD) 13.871
Budgetary Price (1ku) (USD) 10.95
Budgetary Price (1u) (USD) 20.858
CPU M33F
Clock Rate (MHz) 96
Execute from FLASH Yes
Extended Advertising Supported
External Rails and Load Capacity 1x 3V @ 150mA, 3x 1.8V @ 50mA each
Flash Memory (KB) 4096
Flexible System Clock Yes
GATT Caching Not Supported
GPIOs (#) 40
Hardware Crypto Engine Yes
I2C (#) 2
Integrated Battery Charger Yes, 560mA JEITA compliant charger
Integrated DCDC SIMO Buck DC-DC converter
LE Coded PHY (Long Range) Not Supported
LE Data Length Extensions Supported
MCU/MPU M33
MOQ 700
Memory Size (OTP) (KB) 4
Operating Freq (Max) (MHz) 96
Output Power Range (dBm) -18 - 6
Periodic Advertising Supported
Pitch (mm) 1.5
Pkg. Dimensions (mm) 15.85 x 20 x 2.5
Proprietary 2G4 protocol Yes
QSPI Interface (#) 1
RAM (KB) 512
ROM (KB) 128
Recommended for new Designs Yes
Rx current (mA) 1.8
SPI (#) 2
Sensitivity (dBm) (dBm) -96
Supply Voltage Vcc Range 2.4-5.75
Tx Current (mA) 3
UART (#) 3
USB Ports (#) 1
Wireless Standard BLE 5.2 Core specification + optional features

描述

DA14695 模块以 SmartBond™ DA14695 低功耗 (LE) 蓝牙 5.2 片上系统 (SoC)为基础构建,提供 DA14695 所有硬件特性和功能。 该模块集成了所有无源器件、天线和 一个 32Mbit QSPI 闪存,配有简单易用的软件。 DA14695 模块可满足广泛的市场用途,可以通过各地区认证,大幅降低开发成本与风险,缩短上市时间。