Lead Count (#) | 84 |
Pkg. Type | MODULE |
Pitch (mm) | 1.5 |
Pkg. Dimensions (mm) | 15.85 x 20 x 2.5 |
Moisture Sensitivity Level (MSL) | 3 |
Pb (Lead) Free | Yes |
ECCN (US) | |
HTS (US) |
Pkg. Type | MODULE |
Lead Count (#) | 84 |
Carrier Type | Tape & Reel |
Moisture Sensitivity Level (MSL) | 3 |
Qty. per Reel (#) | 100 |
Pb (Lead) Free | Yes |
Temp. Range (°C) | -40 to +85°C |
Price (USD) | 14.5862 |
Country of Assembly | Thailand |
2Mbps | Supported |
ADC | 10-bit x 4-ch, 14-bit x 4-ch |
AoA | Supported |
AoD | TX Supported |
Application | Rechargeable devices, HMI, ATLAS, Asset tracking, Connected health, Proximity tags & trackers |
Bluetooth® Mesh | Not Supported |
Budgetary Price (100u) (USD) | 13.871 |
Budgetary Price (1ku) (USD) | 10.95 |
Budgetary Price (1u) (USD) | 20.858 |
CPU | M33F |
Clock Rate (MHz) | 96 |
Execute from FLASH | Yes |
Extended Advertising | Supported |
External Rails and Load Capacity | 1x 3V @ 150mA, 3x 1.8V @ 50mA each |
Flash Memory (KB) | 4096 |
Flexible System Clock | Yes |
GATT Caching | Not Supported |
GPIOs (#) | 40 |
Hardware Crypto Engine | Yes |
I2C (#) | 2 |
Integrated Battery Charger | Yes, 560mA JEITA compliant charger |
Integrated DCDC | SIMO Buck DC-DC converter |
LE Coded PHY (Long Range) | Not Supported |
LE Data Length Extensions | Supported |
MCU/MPU | M33 |
MOQ | 700 |
Memory Size (OTP) (KB) | 4 |
Operating Freq (Max) (MHz) | 96 |
Output Power Range (dBm) | -18 - 6 |
Periodic Advertising | Supported |
Pitch (mm) | 1.5 |
Pkg. Dimensions (mm) | 15.85 x 20 x 2.5 |
Proprietary 2G4 protocol | Yes |
QSPI Interface (#) | 1 |
RAM (KB) | 512 |
ROM (KB) | 128 |
Recommended for new Designs | Yes |
Rx current (mA) | 1.8 |
SPI (#) | 2 |
Sensitivity (dBm) (dBm) | -96 |
Supply Voltage Vcc Range | 2.4-5.75 |
Tx Current (mA) | 3 |
UART (#) | 3 |
USB Ports (#) | 1 |
Wireless Standard | BLE 5.2 Core specification + optional features |
DA14695 模块以 SmartBond™ DA14695 低功耗 (LE) 蓝牙 5.2 片上系统 (SoC)为基础构建,提供 DA14695 所有硬件特性和功能。 该模块集成了所有无源器件、天线和 一个 32Mbit QSPI 闪存,配有简单易用的软件。 DA14695 模块可满足广泛的市场用途,可以通过各地区认证,大幅降低开发成本与风险,缩短上市时间。