封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | MODULE |
| Pkg. Code: | |
| Lead Count (#): | 84 |
| Pkg. Dimensions (mm): | 15.85 x 20 x 2.5 |
| Pitch (mm): | 1.5 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| RoHS (DA14695MOD-00F3200C) | 英语日文 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | MODULE |
| Lead Count (#) | 84 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Qty. per Reel (#) | 100 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | Thailand |
| 2Mbps | Supported |
| ADC | 10-bit x 4-ch, 14-bit x 4-ch |
| AoA | Supported |
| AoD | TX Supported |
| Application | Rechargeable devices, HMI, ATLAS, Asset tracking, Connected health, Proximity tags & trackers |
| Bluetooth® Mesh | Not Supported |
| CPU | M33F |
| Clock Rate (MHz) | 96 |
| Execute from FLASH | Yes |
| Extended Advertising | Supported |
| External Rails and Load Capacity | 1x 3V @ 150mA, 3x 1.8V @ 50mA each |
| Flash Memory (KB) | 4096 |
| Flexible System Clock | Yes |
| GATT Caching | Not Supported |
| GPIOs (#) | 40 |
| Hardware Crypto Engine | Yes |
| I2C (#) | 2 |
| Integrated Battery Charger | Yes, 560mA JEITA compliant charger |
| Integrated DCDC | SIMO Buck DC-DC converter |
| LE Coded PHY (Long Range) | Not Supported |
| LE Data Length Extensions | Supported |
| MCU/MPU | M33 |
| MOQ | 700 |
| Memory Size (OTP) (KB) | 4 |
| Operating Freq (Max) (MHz) | 96 |
| Output Power Range (dBm) | -18 - 6 |
| Periodic Advertising | Supported |
| Pitch (mm) | 1.5 |
| Pkg. Dimensions (mm) | 15.85 x 20 x 2.5 |
| Price (USD) | $14.5862 |
| Proprietary 2G4 protocol | Yes |
| QSPI Interface (#) | 1 |
| RAM (KB) | 512 |
| ROM (KB) | 128 |
| Recommended for new Designs | Yes |
| Rx current (mA) | 1.8 |
| SPI (#) | 2 |
| Sensitivity (dBm) (dBm) | -96 |
| Supply Voltage Vcc Range | 2.4-5.75 |
| Tx Current (mA) | 3 |
| UART (#) | 3 |
| USB Ports (#) | 1 |
| Wireless Standard | BLE 5.2 Core specification + optional features |
有关 DA14695MOD 的资源
描述
DA14695 模块以 SmartBond™ DA14695 低功耗 (LE) 蓝牙 5.2 片上系统 (SoC)为基础构建，提供 DA14695 所有硬件特性和功能。 该模块集成了所有无源器件、天线和 一个 32Mbit QSPI 闪存，配有简单易用的软件。 DA14695 模块可满足广泛的市场用途，可以通过各地区认证，大幅降低开发成本与风险，缩短上市时间。