封装信息
| Lead Count (#) | 100 |
| Pkg. Code | BV0100AA |
| Pitch (mm) | 0.48 |
| Pkg. Type | VFBGA |
| Pkg. Dimensions (mm) | 5.0 x 5.0 x 0.82 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | 5A992.c |
| HTS (US) | 8542.39.90 |
产品属性
| Lead Count (#) | 100 |
| Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Pb Free Category | N/A |
| Temp. Range | 0 to 70°C |
| Country of Assembly | Taiwan |
| Country of Wafer Fabrication | Taiwan |
| Price (USD) | 1ku | 6.54688 |
| 2Mbps | Supported |
| ADC | 10-bit x 8-ch, 14-bit x 8-ch |
| AoA | Supported |
| AoD | TX Supported |
| Application | Rechargeable devices, HMI, Wearables, 'Analog' Smart Watches, ATLAS, Asset tracking, Connected health, Proximity tags & trackers, Wireless Ranging (WiRa) |
| Bluetooth® Mesh | Not Supported |
| CPU | M33F |
| Clock Rate (MHz) | 96 |
| Execute from FLASH | Yes |
| Extended Advertising | Supported |
| External Rails and Load Capacity | 3x 1.8V @ 50mA each |
| Flash Memory (KB) | 0 |
| Flexible System Clock | Yes |
| GATT Caching | Not Supported |
| GPIOs (#) | 55 |
| Hardware Crypto Engine | Yes |
| I2C (#) | 2 |
| Integrated Battery Charger | Yes, 560mA JEITA compliant charger |
| Integrated DCDC | SIMO Buck DC-DC converter |
| LE Coded PHY (Long Range) | Not Supported |
| LE Data Length Extensions | Supported |
| Length (mm) | 5 |
| Longevity | 2034 1月 |
| MCU/MPU | M33 |
| MOQ | 5000 |
| Memory Size (OTP) (KB) | 4 |
| Operating Freq (Max) (MHz) | 96 |
| Output Power Range (dBm) | -18 - 6 |
| Periodic Advertising | Supported |
| Pitch (mm) | 0.48 |
| Pkg. Dimensions (mm) | 5.0 x 5.0 x 0.82 |
| Pkg. Type | VFBGA |
| Proprietary 2G4 protocol | Yes |
| QSPI Interface (#) | 2 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 5000 |
| RAM (KB) | 512 |
| ROM (KB) | 128 |
| Recommended for new Designs | Yes |
| Reel Size (in) | 13 |
| Rx current (mA) | 1.8 |
| SPI (#) | 2 |
| Sensitivity (dBm) (dBm) | -97 |
| Supply Voltage Vcc Range | 2.4-5.75 |
| Tape & Reel | Yes |
| Thickness (mm) | 0.82 |
| Tx Current (mA) | 3 |
| UART (#) | 3 |
| USB Ports (#) | 1 |
| Width (mm) | 5 |
| Wireless Standard | BLE 5.2 Core specification + optional features |
描述
The SmartBond™ DA1469x family of Bluetooth® Low Energy solutions is a feature-rich range of multi-core microcontroller units for wireless connectivity.
The product family builds off the successes of Renesas' SmartBond line, boasting three additional cores that offer greater processing power, resources, range, and battery life, enabling developers to push the boundaries of a wide array of connected consumer applications. The DA1469x line provides developers with advanced connectivity features to future-proof their devices and fit the needs of multiple applications. Based on the Arm® Cortex®-M33 processor, DA1469x products offer developers greater processing power for intensive applications like high-end fitness trackers, advanced smart home devices, and virtual reality game controllers.
Additionally, these wireless MCUs have a configurable MAC which enables manufacturers to deploy proprietary 2.4GHz and the latest Bluetooth Low Energy 5.2 protocol, opening up possibilities such as accurate positioning for Real-Time Location Systems (RTLS) and low latency communication exchange for applications like gaming. And, to enhance its sensing functionality, the line features a Sensor Node Controller (SNC) that runs autonomously and independently processes data from sensors connected to its interfaces.
Finally, the DA1469x family features a state-of-the-art Power Management Unit that utilizes best-in-class power management by controlling the different processing cores and only activating them as needed, while also eliminating the need for a separate PMIC and reducing the overall system size.
Benefits
- Supports complex applications while guaranteeing extremely low power consumption
- Software programmable protocol engine ensures end products are future proof
- Enables a rich user experience
- Provides banking-level security for application, data, and communication
- Saves up to $1.28 on BOM vs. existing wireless MCUs
- Saves up to 38mm2 of PCB space (components + routing) vs. existing wireless MCUs