Pkg. Type | WAFER |
Pkg. Code | DICEW |
Pitch (mm) | |
Lead Count (#) | 0 |
Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
ECCN (US) | NLR |
HTS (US) | 8542390001 |
Pb (Lead) Free | Yes |
Moisture Sensitivity Level (MSL) |
Pkg. Type | WAFER |
Carrier Type | WFP |
Price (USD) | 1ku | 359.7895 |
Application | 200G Ethernet SR4, 400G Etherenet SR8, QSFP56, QSFP-DD/OSFP |
Channels (#) | 4 |
Data Rate Max (Gbps) | 56 |
Function | CDR / Retimer /Driver |
Lead Count (#) | 0 |
Length (mm) | 0 |
MOQ | 100 |
Pb (Lead) Free | Yes |
Pb Free Category | e3 Sn |
Pitch (mm) | 0 |
Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
Qty. per Carrier (#) | 0 |
Qty. per Reel (#) | 0 |
Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
Tape & Reel | No |
Temp. Range | -5 to 95°C |
Thickness (mm) | 0 |
Width (mm) | 0 |
The HXT14450 is a quad-channel, low power, linear vertical-cavity surface-emitting laser (VCSEL) driver with an integrated clock and data recovery (CDR) unit. The chip is designed for MMF PMD Short-Reach applications that support 200G per port with a signaling rate up to 56Gbps PAM4 modulation. In conjunction with the HXR14450 – a quad-channel transimpedance amplifier (TIA) receiver with an integrated CDR, one can produce compact quad small form factor QSFP-type modules to serve high speed optical interconnects in data center applications.
The HXT14450 has a built-in adaptive linear equalizer and a decision-feedback equalizer (DFE), which can work in chip-to-module and chip-to-chip interconnects. The chipsets provide on-chip testability such as PRBS generator and error checker.
Designed for direct DC-coupled die with VCSEL or on-board optics (OBO) and with a small number of additional components for cost-effective and compact assemblies, this chipset enables lower power and compact modules for high density and high BW application in hyper-scale data center applications.