封装信息
| Lead Count (#) | 32 |
| Pkg. Code | pkg_7475 |
| Pkg. Type | LQFP |
| Pkg. Dimensions (mm) | 7 x 7 x 1.7 |
环境和出口类别
| ECCN (US) | 3A991 |
| RoHS (R5F21335TNFP#30) | 英语日文 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| HTS (US) |
产品属性
| RAM (KB) | 2 |
| Lead Count (#) | 32 |
| Temp. Range | -20 to +85°C |
| ADC | 10-bit x 12-ch |
| Bit Size | 16 |
| CPU | R8C |
| DMA | Yes |
| Data Flash (KB) | 4 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 27 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Length (mm) | 7 |
| Longevity | 2029 1月 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 7 x 7 x 1.7 |
| Pkg. Type | LQFP |
| Program Memory (KB) | 24 |
| RTC | No |
| Supply Voltage (V) | 1.8 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 1.7 |
| Timer | 8-bit x 2-ch, 16-bit x 1-ch |
| Width (mm) | 7 |
描述
The R8C/33T Group is supported only for customers who have already adopted these products. The RX130 Group is recommended for new designs.
The R8C/33T Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/33T Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.