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封装信息

CAD 模型:View CAD Model
Pkg. Type:LQFP
Pkg. Code:pkg_712
Lead Count (#):52
Pkg. Dimensions (mm):10 x 10 x 1.7
Pitch (mm):

环境和出口类别

RoHS (R5F2L357ANFP#V2)英语日文
Moisture Sensitivity Level (MSL)
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

产品属性

ADC10-bit x 10-ch
Bit Size16
CPUR8C
DAC8-bit x 2-ch
DMANo
Data Flash (KB)4
EthernetNo
Family NameR8C
LVD or PVDNo
Lead CompliantYes
Lead Count (#)52
Length (mm)10
MOQ1
Operating Freq (Max) (MHz)20
Pb (Lead) FreeYes
Pkg. Dimensions (mm)10 x 10 x 1.7
Pkg. TypeLQFP
RTCYes
Tape & ReelNo
Temp. Range (°C)-20 to +85
Thickness (mm)1.7
Timer8-bit x 3-ch, 16-bit x 4-ch
Width (mm)10

描述

The R8C/L35A, R8C/L35B Group is supported only for customers who have already adopted these products. The RL78/L12, L13 Groups are recommended for new designs.

The R8C/56E Group, R8C/56F Group, R8C/56G Group, R8C/56H Group of single-chip microcontrollers (MCUs) incorporate the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.

Power consumption is low, and additional power control is possible by selecting the operating mode. The R8C/56E Group, R8C/56F Group, R8C/56G Group, R8C/56H Group are also designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface on the same chip, reduces the number of system components. The R8C/56E Group and R8C/56F Group incorporate one channel of CAN module, ideal for the LAN systems of automotive and factory automation applications. The R8C/56G Group and R8C/56H Group do not incorporate the CAN module. The R8C/56E Group and R8C/56G Group also have on-chip data flash (1KB × 4 blocks) with background operation (BGO) function.