Pkg. Code | pkg_712 |
Lead Count (#) | 52 |
Pkg. Type | LQFP |
Pkg. Dimensions (mm) | 10 x 10 x 1.7 |
ECCN (US) | 3A991 |
RoHS (R5F2L35ABDFP#V2) | 英语日文 |
Moisture Sensitivity Level (MSL) | |
Pb (Lead) Free | Yes |
HTS (US) |
ADC | 10-bit x 10-ch |
Bit Size | 16 |
CPU | R8C |
DAC | 8-bit x 2-ch |
DMA | No |
Ethernet | No |
Family Name | R8C |
LVD or PVD | No |
Lead Compliant | Yes |
Lead Count (#) | 52 |
Length (mm) | 10 |
MOQ | 1 |
Operating Freq (Max) (MHz) | 20 |
Pb (Lead) Free | Yes |
Pkg. Dimensions (mm) | 10 x 10 x 1.7 |
Pkg. Type | LQFP |
RTC | Yes |
Tape & Reel | No |
Temp. Range | -40 to +85°C |
Thickness (mm) | 1.7 |
Timer | 8-bit x 3-ch, 16-bit x 4-ch |
Width (mm) | 10 |
The R8C/L35A, R8C/L35B Group is supported only for customers who have already adopted these products. The RL78/L12, L13 Groups are recommended for new designs.
The R8C/56E Group, R8C/56F Group, R8C/56G Group, R8C/56H Group of single-chip microcontrollers (MCUs) incorporate the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.
Power consumption is low, and additional power control is possible by selecting the operating mode. The R8C/56E Group, R8C/56F Group, R8C/56G Group, R8C/56H Group are also designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface on the same chip, reduces the number of system components. The R8C/56E Group and R8C/56F Group incorporate one channel of CAN module, ideal for the LAN systems of automotive and factory automation applications. The R8C/56G Group and R8C/56H Group do not incorporate the CAN module. The R8C/56E Group and R8C/56G Group also have on-chip data flash (1KB × 4 blocks) with background operation (BGO) function.