封装信息
环境和出口类别
| ECCN (US) | 3A991 |
| RoHS (R5F2L36CANFA#V2) | 英语日文 |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| HTS (US) |
产品属性
| DMA | No |
| Ethernet | No |
| Family Name | R8C |
| LVD or PVD | No |
| Lead Compliant | Yes |
| MOQ | 1 |
| Pb (Lead) Free | Yes |
| RTC | No |
| Tape & Reel | No |
描述
The R8C/L36A, R8C/L36B Group is supported only for customers who have already adopted these products. The RL78/L12, L13 Groups are recommended for new designs.
The R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, and R8C/L3AM Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and supports a 1Mb address space, allowing execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the number of system components. These groups have data flash (1KB × 4 blocks) with the background operation (BGO) function.