| CAD 模型: | View CAD Model |
| Pkg. Type: | DIP |
| Pkg. Code: | pkg_8685 |
| Lead Count (#): | 14 |
| Pkg. Dimensions (mm): | |
| Pitch (mm): |
| RoHS (R5F2M111ANDD#U0) | 英语日文 |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
| Carrier Type | Tube |
| ADC | 10-bit x 5-ch |
| Bit Size | 16 |
| CPU | R8C |
| DMA | No |
| Data Flash (KB) | 2 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 11 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Lead Count (#) | 14 |
| Length (mm) | 19 |
| MOQ | 1 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Type | DIP |
| Program Memory (KB) | 4 |
| RAM (KB) | 0.375 |
| RTC | No |
| Supply Voltage (V) | 1.8 - 5.5 |
| Tape & Reel | No |
| Temp. Range (°C) | -20 to +85 |
| Timer | 8-bit x 1-ch, 16-bit x 3-ch |
| Width (mm) | 6 |
The R8C/M12A Group is supported only for customers who have already adopted these products. The RL78/G12, RL78/G11 Groups are recommended for new designs.
The R8C/LA3A Group, R8C/LA5A Group, R8C/LA6A Group, and R8C/LA8A Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and supports a 1Mb address space, allowing execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the number of system components. The R8C/LA3A Group, R8C/LA5A Group, R8C/LA6A Group, and R8C/LA8A Group have data flash.