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瑞萨电子 (Renesas Electronics Corporation)
1GHz Arm Cortex-M85 和 Cortex-M33 双核高性能 MCU

封装信息

CAD 模型:View CAD Model
Pkg. Type:LFBGA
Pkg. Code:pkg_20158
Lead Count (#):224
Pkg. Dimensions (mm):11 x 11 x 1.38
Pitch (mm):0.65

环境和出口类别

Moisture Sensitivity Level (MSL)3
RoHS (R7KA8M2JFECAB#BC1)英语日文
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

产品属性

Carrier TypeFull Carton (Tray)
Family NameRA
Series NameRA8
Group NameRA8M2
CPU ArchitectureArm
Main CPUArm Cortex-M85
Sub CPUYes
Floating Point UnitDouble/Single/Half
Bit Length32
Program Memory (KB)1024
Data Flash (KB)0
RAM (KB)2048
ECC SRAMYes
Lead Count (#)224
Pitch (mm)0.65
Pkg. Dimensions (mm)11 x 11 x 1.38
Number of Supply Voltage(s) (#)1
Supply Voltage (V)1.62 - 3.6
I/O Ports149
DMAC or DTCDMAC&DTC
DMA (ch)16
Temperature Sensor (ch) (#)1
Power-On ResetYes
Watchdog Timer (ch)3
External Memory Bus (bit)16
DRAM I/FSDRAM
3D GPUNo
AcceleratorNo
Temp. Range (°C)Tj = -40 to +125
External Interrupt Pins (#)32
LVD or PVDYes
Operating Freq (Max) (MHz)600
Operating Freq of Sub CPU (Max)200
Sub-clock (32.768 kHz)Yes
On-chip OscillatorYes
Ethernet speed10M/100M/1G
Ethernet (ch)2
EtherCat (ch) (#)0
USB Ports (#)2
USB FS (host ch/device ch)( 1 / 1 )
USB HS (host ch/device ch)( 1 / 1 )
USB SS (host ch/device ch)( 0 / 0 )
PCI Express (generation and ch)No
SCI or UART (ch)9
SPI (ch)2
QSPI (ch)0
OSPI (ch)1
I2C (#)3
I3C (ch)1
CAN (ch)0
CAN-FD (ch)2
WirelessNo
IrDANo
LIN (#)0
SDHI (ch)2
High Resolution Output TimerYes
PWM Output (pin#)28
32-Bit Timer (ch)16
16-Bit Timer (ch) (#)0
8-Bit Timer (ch)0
Standby operable timerYes
Asynchronous General Purpose Timer / Interval Timer (ch)2
RTCYes
16-Bit A/D Converter (ch)12
14-Bit A/D Converter (ch)0
12-Bit A/D Converter (ch)0
10-Bit A/D Converter (ch)0
24-Bit Sigma-Delta A/D Converter (ch)0
16-Bit D/A Converter (ch)0
12-Bit D/A Converter (ch)2
10-Bit D/A Converter (ch) (#)0
8-Bit D/A Converter (ch)0
Analog Comparator (ch)4
OPAMP (ch) (#)0
PGA (ch)0
Capacitive Touch Sensing Unit (ch)0
Graphics LCD ControllerNo
MIPI Interfaces (DSI) (ch)0
MIPI Interfaces (CSI) (ch)0
Camera I/F (Parallel)16-bit
Image CodecNo
2D Drawing EngineNo
Segment LCD ControllerNo
SSI (ch)2
Security & EncryptionUnique ID, TRNG, AES(128/192/256), CHA-CHA20, SHA2, SHA3, ECC, Ed25519, RSA-4K, HMAC, GHASH, Wrapped Keys, DLM, SPA/DPA Protection, Tamper Detection, Arm TrustZone
Debug InterfaceJTAG/SWD
Moisture Sensitivity Level (MSL)3
Family NameRA
Group NameRA8M2
Lead CompliantYes
Length (mm)11
MOQ1408
NPUNo
Pb (Lead) FreeYes
Pkg. TypeLFBGA
Suggested KitsEK-RA8M2
Tape & ReelNo
Thickness (mm)1.38
Width (mm)11

描述

RA8M2 系列是 32 位通用 MCU,集成了支持 Helium™ 矢量扩展功能的 1GHz Arm® Cortex®-M85 和 250MHz Cortex-M33 内核,CoreMark CPU 性能测试超过 7300 分,可满足各种严苛场景的需求。 此MCU 是工业自动化、家用电器、智能家居、消费电子、楼宇/家庭自动化和医疗/保健细分市场中高算力应用场景的理想之选。

RA8M2 MCU 集成了大容量片上 MRAM 和 SRAM 存储器、多个存储器接口和丰富的外设集,有助于实现高效的系统设计并降低成本。 MRAM 能为关键数据提供非易失性、高可靠性的存储保障。 该系列 MCU 采用 176 引脚至 303 引脚的多规格封装选择,结温最高可达 125°C,适用于各种工业与物联网/消费电子领域。 该芯片内置类似 Secure Element 的功能,搭配先进的加密安全 IP、不可变存储和防篡改保护功能,可保障数据的私密性与完整性。

RA8M2 MCU 由灵活软件包 (FSP) 和一整套软硬件开发工具提供全面支持。