NEW
Pitch (mm) | 0.5 |
Lead Count (#) | 244 |
Pkg. Type | LFBGA |
Pkg. Dimensions (mm) | 13 x 13 x 1.4 |
Pkg. Code | pkg_20049 |
Moisture Sensitivity Level (MSL) | 3 |
ECCN (US) | 3A991 |
RoHS (R9A07G066M04GBG#BC0) | 英语日文 |
Pb (Lead) Free | Yes |
HTS (US) |
Carrier Type | Full Carton (Tray) |
Family Name | RZ |
Series Name | RZ/A |
Group Name | A3M |
CPU Architecture | Arm |
Main CPU | Cortex-A55 |
Sub CPU | No |
Floating Point Unit | Double/Single |
Bit Length | 64 |
Program Memory (KB) | 0 |
Data Flash (KB) | 0 |
RAM (KB) | 131072 |
ECC SRAM | Yes |
Lead Count (#) | 244 |
Pkg. Type | LFBGA |
Pitch (mm) | 0.8 |
Pkg. Dimensions (mm) | 17 x 17 x 1.4 |
Number of Supply Voltage(s) (#) | 4 |
Supply Voltage (V) | 2.97 - 3.63 |
I/O Ports | 70 |
DMAC or DTC | DMAC |
DMA (ch) | 16 |
Temperature Sensor (ch) (#) | 1 |
Power-On Reset | No |
Watchdog Timer (ch) | 1 |
External Memory Bus (bit) | No |
DRAM I/F | No |
3D GPU | No |
Accelerator | No |
Temp. Range | Ta = -40 to +85°C |
External Interrupt Pins (#) | 78 |
LVD or PVD | No |
Operating Freq (Max) (MHz) | 1000 |
Operating Freq of Sub CPU (Max) | 0 |
Sub-clock (32.768 kHz) | No |
On-chip Oscillator | No |
Ethernet speed | No |
Ethernet (ch) | 0 |
EtherCat (ch) (#) | 0 |
USB Ports (#) | 1 |
USB FS (host ch/device ch) | ( 0 / 0 ) |
USB HS (host ch/device ch) | ( 1 / 1 ) |
USB SS (host ch/device ch) | ( 0 / 0 ) |
PCI Express (generation and ch) | No |
SCI or UART (ch) | 7 |
SPI (ch) | 2 |
QSPI (ch) | 1 |
OSPI (ch) | 0 |
I2C (#) | 2 |
I3C (ch) | 0 |
CAN (ch) | 0 |
CAN-FD (ch) | 0 |
Wireless | No |
IrDA | No |
LIN (#) | 0 |
SDHI (ch) | 1 |
High Resolution Output Timer | No |
PWM Output (pin#) | 28 |
32-Bit Timer (ch) | 1 |
16-Bit Timer (ch) (#) | 8 |
8-Bit Timer (ch) | 0 |
Standby operable timer | No |
Asynchronous General Purpose Timer / Interval Timer (ch) | 3 |
RTC | No |
16-Bit A/D Converter (ch) | 0 |
14-Bit A/D Converter (ch) | 0 |
12-Bit A/D Converter (ch) | 0 |
10-Bit A/D Converter (ch) | 0 |
24-Bit Sigma-Delta A/D Converter (ch) | 0 |
16-Bit D/A Converter (ch) | 0 |
12-Bit D/A Converter (ch) | 0 |
10-Bit D/A Converter (ch) (#) | 0 |
8-Bit D/A Converter (ch) | 0 |
Analog Comparator (ch) | 0 |
OPAMP (ch) (#) | 0 |
PGA (ch) | 0 |
Capacitive Touch Sensing Unit (ch) | 0 |
Graphics LCD Controller | Yes |
MIPI Interfaces (DSI) (ch) | 1 |
MIPI Interfaces (CSI) (ch) | 0 |
Camera I/F (Parallel) | No |
Image Codec | No |
2D Drawing Engine | Yes |
Segment LCD Controller | No |
SSI (ch) | 1 |
Security & Encryption | No |
Debug Interface | JTAG/SWD |
Moisture Sensitivity Level (MSL) | 3 |
Country of Assembly | Taiwan |
Country of Wafer Fabrication | South Korea |
Price (USD) | 1ku | 13.78503 |
Family Name | |
Group Name | |
Lead Compliant | Yes |
Length (mm) | 17 |
MOQ | 720 |
Pb (Lead) Free | Yes |
Suggested Kits | |
Tape & Reel | No |
Thickness (mm) | 1.4 |
Width (mm) | 17 |
64 位 RZ/A3M 微处理器 (MPU) 集成了高性能 1GHz Arm® - Cortex®-A55 内核,内置 128MB DDR3L 内存和图形外设功能,其图形处理能力经过优化,可满足消费和工业领域多样化的图形和人机界面 (HMI) 要求。 该处理器具备以下特性:高分辨率图形 LCD 控制器(配备并行 RGB 和 4 通道 MIPI-DSI 接口,可连接显示面板)、2D 图形绘制引擎、SPI NAND 闪存和 SPI NOR 闪存(可运行大型程序)。 所有这些功能在244 引脚 LFBGA 封装上实现。此封装非常适合双层电路板设计,可满足更多功能需求和更广泛的 HMI/图形应用场景需求,包括实时绘图、流畅的精灵动画、USB 摄像头捕捉等。 支持 RTOS ,在完成引导启动 (boot-up) 后不到一秒的时间内立即实现系统运行就绪 (start up)。 这一特性非常适合需要快速响应的系统。