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Cordless Voice Module

封装信息

CAD 模型: View CAD Model
Pkg. Type: MOD
Pkg. Code:
Lead Count (#): 88
Pkg. Dimensions (mm): 19.6 x 18 x 2.7
Pitch (mm):

环境和出口类别

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

产品属性

Pkg. Type MOD
Lead Count (#) 88
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
Temp. Range (°C) -20 to +60°C
Country of Assembly TAIWAN
Country of Wafer Fabrication UNITED STATES
Bandwidth (MHz) 0.0113
Charge Control NiMH and Alkaline batteries
Data Rate (Mbps) 0.0016
Device Functions Module
I/O Type UART, SPI, PCM
MOQ 600
Memory External No
Pkg. Dimensions (mm) 19.6 x 18 x 2.7
Power Amplifier 23
Price (USD) $13.88375
Processor CPU MIPS (MIPS) 80
Processor DSP MIPS (MIPS) 80
Qty. per Reel (#) 600
Radio DECT (6.0) Yes
Radio JDECT Yes
Radio KDECT No
Software Support Flexible API Interface

描述

The SC14CVMDECT Cordless Voice Module (CVM) Development Kit consists of two development boards with headsets, enabling voice connection setup. It enables the easy and cost-effective development of cordless applications and significantly reduces the time-to-market.

All the features of the module are accessible through the pins on the development board, while buttons and LED statuses can be changed and checked. The CVM kit comes with the Athena development environment, an Eclipse-based IDE that provides a development environment for the CR16C+ series of microcontrollers, and a GNU cross compiler/linker for CR16 – removing the need for an external microcontroller.