封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | FCBGA |
| Pkg. Code: | HC503 |
| Lead Count (#): | 503 |
| Pkg. Dimensions (mm): | 33.0 x 33.0 x 2.75 |
| Pitch (mm): | 1.27 |
环境和出口类别
| Pb (Lead) Free | No |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | FCBGA |
| Lead Count (#) | 503 |
| Pb (Lead) Free | No |
| Carrier Type | Tray |
| DRAM I/F | SDRAM - 133MHz |
| Length (mm) | 33 |
| MOQ | 48 |
| Moisture Sensitivity Level (MSL) | 3 |
| PCI Bus | 66MHz/64 bit PCI |
| Package Area (mm²) | 1089 |
| Pb Free Category | e0 |
| Pitch (mm) | 1.27 |
| Pkg. Dimensions (mm) | 33.0 x 33.0 x 2.75 |
| Power Consumption Max (W) | 2.5 |
| Processor Bus | PowerPC (MPC7xx)-100MHz |
| Qty. per Carrier (#) | 24 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Temp. Range (°C) | 0 to 105°C |
| Thickness (mm) | 2.75 |
| Width (mm) | 33 |
有关 TSI107 的资源
描述
The TSI107 Host Bridge for PowerPC provides system interconnect between PowerPC processors, PCI peripherals, and local memory. The TSI107 provides many of the other necessities for embedded applications, including a high-performance memory controller and dual processor support; two-channel flexible DMA controller, an interrupt controller, an I2O-ready message unit, an inter-integrated circuit controller (I2C), and low-skew clock drivers.