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封装信息

Lead Count (#) 1023
Pkg. Code HM1023
Pitch (mm) 1
Pkg. Type FCBGA
Pkg. Dimensions (mm) 33.0 x 33.0 x 2.0

环境和出口类别

Pb (Lead) Free No
ECCN (US) NLR
HTS (US) 8542390000
Moisture Sensitivity Level (MSL) 4

产品属性

Lead Count (#) 1023
Pb (Lead) Free No
Carrier Type Tray
DRAM I/F DDR2-400
Length (mm) 33.0
MOQ 48
Moisture Sensitivity Level (MSL) 4
PCI Bus 133MHz/64-bit PCI-X
Package Area (mm²) 1089.0
Pb Free Category e0
Pitch (mm) 1.0
Pkg. Dimensions (mm) 33.0 x 33.0 x 2.0
Pkg. Type FCBGA
Power Consumption Max (W) 3.7
Processor Bus PowerPC 7xx/7448 -200MHz
Qty. per Carrier (#) 24
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range 0 to 70°C
Thickness (mm) 2.0
Width (mm) 33.0

描述

The TSI108 host bridge for PowerPC processors supports PCI-X, DDR2-400 SDRAM, Gigabit Ethernet, and Flash. The TSI108 is optimized for customers in the wireless infrastructure, storage networking, network access, printer, military, and industrial automation markets. Its flexible configuration options allow designers to develop their systems quickly and efficiently. It minimizes active power by disabling unused ports and clocks, while its integrated Clock Generator saves power over discrete devices.