跳转到主要内容

封装信息

CAD 模型: View CAD Model
Pkg. Type: FCBGA
Pkg. Code: HM1023
Lead Count (#): 1023
Pkg. Dimensions (mm): 33.0 x 33.0 x 2.0
Pitch (mm): 1

环境和出口类别

Pb (Lead) Free No
Moisture Sensitivity Level (MSL) 4
ECCN (US)
HTS (US)

产品属性

Lead Count (#) 1023
Pb (Lead) Free No
Carrier Type Tray
DRAM I/F DDR2-400
Length (mm) 33
MOQ 48
Moisture Sensitivity Level (MSL) 4
PCI Bus 133MHz/64-bit PCI-X
Package Area (mm²) 1089
Pb Free Category e0
Pitch (mm) 1
Pkg. Dimensions (mm) 33.0 x 33.0 x 2.0
Pkg. Type FCBGA
Power Consumption Max (W) 3.7
Price (USD) $378.71292
Processor Bus PowerPC 7xx/7448 -200MHz
Qty. per Carrier (#) 24
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) -40 to 85°C
Thickness (mm) 2
Width (mm) 33
已发布 No

描述

The TSI109 is a host bridge for PowerPC processors that supports PCI-X, DDR2-400 SDRAM, Gigabit Ethernet, and Flash. The device contains numerous integrated features that enable customers to reduce system design complexity and system costs. The TSI109 delivers industry-leading performance for customers in the wireless infrastructure, storage networking, network access, printer, military, and industrial automation markets.