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瑞萨电子 (Renesas Electronics Corporation)
PCIe to PCI-X Bridge

封装信息

CAD 模型:View CAD Model
Pkg. Type:PBGA
Pkg. Code:AM256
Lead Count (#):256
Pkg. Dimensions (mm):17.0 x 17.0 x 1.61
Pitch (mm):1

环境和出口类别

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

产品属性

Pkg. TypePBGA
Lead Count (#)256
Pb (Lead) FreeNo
Carrier TypeTray
Length (mm)17
MOQ90
Moisture Sensitivity Level (MSL)3
PCI Express (generation and ch)1.1
PCIe GenerationGen1
PCIe Lanes (#)4
Package Area (mm²)289
Pb Free Categorye0
Pitch (mm)1
Pkg. Dimensions (mm)17.0 x 17.0 x 1.61
Primary PCI BusPCIe x4
Qty. per Carrier (#)90
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Secondary Bus32-bit PCI-X 133MHz, 64-bit PCI-X 133MHz
Tape & ReelNo
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.61
Transparency ModeNon-transparent, Transparent, Opaque
Width (mm)17
已发布No

描述

The Tsi384 provides a high performance, small footprint bridge from x4 PCI Express interface to PCI-X at 133 MHz. Three types of addressing modes are supported; transparent, opaque and non-transparent, giving designers flexibility.