封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | LFQFP |
| Pkg. Code: | pkg_3012 |
| Lead Count (#): | 64 |
| Pkg. Dimensions (mm): | 10 x 10 x 1.6 |
| Pitch (mm): | 0.5 |
环境和出口类别
| RoHS (UPD70F3371M2GBA1-GAH-AX) | 英语日文 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Program Memory (KB) | 256 |
| RAM (KB) | 16 |
| Lead Count (#) | 64 |
| CAN (ch) | 1 |
| I/O Ports | 51 |
| Timer | 16-bit x 7-ch |
| ADC | 10-bit x 10-ch |
| DMA | Yes |
| Temp. Range (°C) | -40 to +110 |
| Bit Size | 32 |
| CPU | V850ES |
| Data Flash (KB) | 32 |
| Ethernet | No |
| Family Name | V850 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Length (mm) | 10 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 32 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 10 x 10 x 1.6 |
| Pkg. Type | LFQFP |
| RTC | No |
| Supply Voltage (V) | 3.3 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 1.6 |
| Width (mm) | 10 |
有关 V850ES/Fx3 的资源
描述
The V850ES/Fx3 is supported only for customers who have already adopted these products. The RH850/F1L or RH850/F1H Group is recommended for new designs.