网络研讨会

In this session, we will examine the implementation of Trustzone-M in Renesas Cortex-M33 based RA4 and RA6 MCUs, along with the additional features that build on top of this to further enhance embedded security. Also covered will be the software development tools that provide the necessary workflows to allow customers to deliver a secure system.

eProsima is the company behind micro-ROS and it is key-partnering with Renesas. The Renesas RA Family of microcontrollers is the micro-ROS recommended MCU and provides professional technical support at [email protected]. This webinar gives you the key insights of ROS and micro-ROS. We will demonstrate how to develop open source robotic applications using the RA Family.

During this webinar, we're going to:
- Highlight the key functionality of the DA16200 Ultra-Low Power Wi-Fi SoC
- Highlight and explain the extended AT Command functionality
- Show wi-fi implementation details on the RA6M4 MCU host
- Demonstrate ready-to-go ultra-low power wi-fi using Renesas RA6 Series MCUs as an example using the SparkFun Wi-Fi Shield

Renesas is contributing to the acceleration of customer development through our Winning Combination system solutions. The Webinar is focusing on two xEV applications, BMS*1 & inverter. For BMS, our application model & software solution reduces R&D*2 effort by providing sample application models that estimates SOC*3 & SOH*4. For xEV inverter, Renesas can help customers shorten development time by supporting system level functional safety.

*1 Battery Management System, *2 Research and Development, *3 State Of Charge, *4 State Of Health

Key takeaways
 Jumpstart the process of learning the Renesas environment
 Speed up time to market with sample models, reducing rework in BMS development
 Reduce both application software and firmware development effort for BMS
 Support for functional safety concept reduces development time at the system level for xEV inverter

Speakers:
Mr. Masuo Okuda, Senior Manager, Automotive Analog Marketing and Advanced Engineering Department, Automotive Analog Product Marketing Division, Renesas Electronics Inc.
Mr. Masashi Tsubota, Senior Principal Specialist, Automotive Analog Marketing and Advanced Engineering Department, Automotive Analog Product Marketing Division, Renesas Electronics Inc.

随着使用AI来实现实时识别应用的需求不断扩大，AI处理所产生的高功耗和发热量增加正是市场所关注的问题。此外, 具有成本效益的解决方案也是扩大终端AI市场规模的必须条件。
随着数字化转型和智能楼宇的高渗透率，这个不断扩大的市场需要更具成本效益的解决方案。然而，在实施具有成本效益的解决方案时会遇到以下三个问题:
1. 同时兼具高速AI推理和低功耗
2. 要求降低系统成本
3. 需要高效的产品开发
诚邀大家参与此网络研讨会，可以了解瑞萨电子的 RZ/V 系列 MPU 如何解决以上三个问题。

In this webinar you will learn:
- The TINY™ Module: content, design, package, etc.
- Worldwide certification
- Development kit
- CodeLess SW development and ready-to-use examples
- Resources and support
- How quick and easy it is to develop your new products with the DA14531 SmartBond TINY™ Module

As customers move towards Brushless DC (BLDC) from traditional brushed motors to take advantage of the power efficiency, torque efficacy, size and reliability benefits, there are new design considerations to understand. Unlike brushed motors with a mechanical commutator, BLDC motors need an electronic commutator which can be more challenging to implement. This webinar will address these challenges and show how Renesas solutions can make it easy to drive BLDC motors with new tools, resources, and algorithms.

In this webinar, we will discuss:
- How endpoint intelligence will have a profound impact on how we interact with IoT devices
- Renesas technologies and solutions to help increase endpoint intelligence for a wide range of applications
- The evolution of artificial intelligence (AI)
- AI / Machine Learning technology, landscape, and construct
- Robust end-to-end security
- Use case examples

In this webinar, we will explore how active beamforming ICs can simplify phased array antennas for 5G, Satcom and Radar applications.
Three generations of active beamforming ICs based on highly integrated silicon technology have led to the commercialization of active phased array antennas for a variety of systems. This session will review common antenna architectures and design challenges of phased array antennas. We will delve into the features that simplify product design and reduce time to market, such as compact size, high power efficiency, Dynamic Array Power (DAP™), ArraySense™ and RapidBeam™ technologies.

During this webinar we’re going to:
- Highlight the Production Line Tool - what is it?
- Show how to lower overall cost of tester equipment
- Demonstrate how easy it is to parallel program and test up to 16 devices

During this webinar we’re going to:
- Highlight mikroBUS and the DA14531 Module - what is it?
- Show how easy it is to work with a mikroBUS accelerometer sensor click board plugged into a DA14531 TINY™ Click board
- Show how to add a Bluetooth LE data pipe to an MCU
- Demonstrate how simple it is to start prototyping, using the TINY BLE Click board

This webinar revolves around Wi-Fi 6 TWT, followed by DA16200's Universal-TWT feature, which is an excellent way for battery-powered devices to conserve power with no strings attached. The webinar also covers the similarities between Universal-TWT and Wi-Fi 6 TWT, as well as the advantages of Universal-TWT over Wi-Fi 6 TWT.

该产品是新一代的微控制器，集Arm® Cortex®-M23强大的32位CPU性能与瑞萨产品的卓越片上功能和封装于一身。在本次演示中，我将解释为什么这款入门级RA系列产品RA2E2是适合物联网边缘设备的理想解决方案。

Learn how to enable your process controller to communicate with Modbus devices using a modular object-based Modbus TCP stack that can serve as both master or slave (client or server) with all the function codes in a convenient portable stack.

- Provide various frameworks that will help you decide what makes sense for your next IoT product.
- Review hidden costs that you might encounter for in-house module development such as RF design resources, antenna matching, regulatory approvals, and more.
- Provide breakeven analysis templates to enable financial analysis of building in-house vs. buying from a chip vendor or a third party.