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Packaging Functions

A semiconductor package is the case that surrounds semiconductor chip on which device or integrated circuit is formed. There are a variety of packages from a single chip package to System In Package (SIP) in which several chips form an electronic system. However, their basic functions are same.

Example of SiP structure (SiP technology of 5 stacked chips)

Basic Package Functions

1. Protect from Environmental Influences

Semiconductor chips are sensitive to the environment. The package protects from environmental influences such as moisture, chemical substances, dust, light, and mechanical stress.

2. Provide Electrical Connectivity

There is a mismatch in size between semiconductor chip and PWB, Printed Wiring Board. Moreover, the terminal material of the chip is not appropriate to soldering. The package's external terminals which are suitable for soldering to PWB connect to the semiconductor chip.

3. Dissipate Heat

The semiconductor chip heats up during operation. If the temperature becomes higher than a certain value, it will malfunction. The package is a heat path to environment. Therefore, its material and structure is significant to heat dissipation.

4. Improve Handling

The size of package makes mechanical and manual handling easier in board assembly.

Package Variations

Variations

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