Balaji Kanigicherla serves as Vice President, Head of Engineering and Chief Technology Officer (CTO) at Renesas Electronics Corporation. He has held his current role since January 2026. He is responsible for driving innovation office initiatives, long range critical technologies, IPs & Technologies, EDA/CAD and common product/test engineering.
Prior to his current role, he served as Vice President, Head of Engineering, and Co-Chief Technology Officer from January 2025. He brings about 30 years of experience in semiconductor product architectures, chip development, and business management across PC, data center, automotive, embedded systems, IoT, smartphone, graphics, networking, and communications.
Before joining Renesas in 2022, he held leadership roles at Intel Corporation as Corporate Vice President and General Manager and at INEDA Systems as Founder and CEO, where he led the development of innovative semiconductor solutions and multiple industry-first product architectures. Earlier, he held senior engineering positions at AMD, Conexant Systems, Ikanos Communications, Velio Communications, and Intel.
Kanigicherla holds 17 U.S. patents in IP, SoC, and system architectures and has a strong record of building high-performance engineering teams, delivering innovative solutions, and securing design wins with top-tier customers.
He earned a Master of Science degree in Electrical Engineering from Arizona State University.
图像  | Follow @Balaji Kanigicherla on LinkedIn |
