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瑞萨博客

Confidence in the use of software tools in AI/ML development

Renesas FuSa Support for Automotive (4) – Confidence in the use of software tools in AI/ML development

We discuss the uniqueness of AI/ML tools when considering safety, give an overview of what are the AI/ML tools, how they contribute to ADAS/AD development, and explore the challenges in ensuring confidence in use of AI/ML software tools.

Blog main image RZ/V2MA

AI MPU RZ/V2MA Introduction

AI-MPU RZ/V2MA is newly added on Renesas RZ/V series lineup. I would like to introduce this AI MPU’s three major use cases.

瑞萨电子参与“瑶光2025奇瑞 Tech Day”,并荣获奇瑞汽车2021年度“最佳支持奖”

瑞萨电子参与“瑶光2025奇瑞 Tech Day”,并荣获奇瑞汽车2021年度“最佳支持奖”

展会中瑞萨展示了 MCU,SOC,成长性的电源和模拟产品,为奇瑞在国内国际市场开拓疆土提供多样化的供应和稳定的质量助力。

A Paradigm Shift in Automotive Pressure Sensing

A Paradigm Shift in Automotive Pressure Sensing

The new RAA2S425x Family of ICs for automotive pressure sensing systems provide highly accurate amplification and sensor-specific correction of signals in automotive xEV/PHEV/FCEV and BEV pressure sensing braking, transmission and HVAC systems.

瑞萨电子-零跑汽车技术交流会

瑞萨电子-零跑汽车技术交流会

瑞萨电子于九月十五日在零跑汽车杭州总部举办技术交流活动,并与零跑汽车硬件软件团队分享了瑞萨在新能源汽车上的产品和解决方案.

Blog: Infusion Level Monitor Using Capacitive Touch Sensing RX140 Winning Combination

关于使用了电容式触控传感器的输液液位监测仪的介绍

本期将为大家介绍一种输液液位监测解决方案,其通过低价铜箔电极形成的电容式触控传感器来检测输液余量。

Easily Migrate Applications Across Arm® & RISC-V CPU

跨Arm®和RISC-V CPU轻松迁移应用程序

千秋介绍一种高效开发环境,可减少Arm和RISC-V等不同CPU之间的资源移植

Radar Transceivers: Key Components for ADAS & Autonomous Driving  - Blog 5: Radar Architecture: How to Connect Different Radar Sensors

雷达架构:如何连接不同雷达传感器

在这篇新博客中,我们将分析实施下一代汽车雷达系统的主流架构趋势。

Renesas Engineering Community

RenesasRulz is Now the Renesas Engineering Community

The Renesas Engineering Community, formerly RenesasRulz, is a great resource to get online technical support on our popular product lines.

Renesas RF Technology Overview Blog

Renesas RF Technology Overview

Renesas offers an expanding portfolio of RF products across different functions, frequency coverage, power levels, and technologies as well as process and packaging technologies and a legacy of circuit innovation.