What’s New in Bluetooth® 5.3 Low Energy
This blog presents an overview of the latest Bluetooth Low Energy (LE) specification release 5.3 and the value those new features will bring to Renesas customers and their next-generation designs.
This blog presents an overview of the latest Bluetooth Low Energy (LE) specification release 5.3 and the value those new features will bring to Renesas customers and their next-generation designs.
The unified and scalable SMARC EVK platform makes it easy for customers to evaluate their products quickly and expand their product lineup by changing the CPU-embedded modules.
Providing coverage across all mainstream Renesas MCUs from 8 to 32 bits, the Renesas Ready Partner Network makes it simple to find and integrate solutions tailored to your requirements.
Various networks can be executed on an MCU using 8-bit quantization, which has a large effect in reducing the ROM/RAM usage of a neural network with little decrease in accuracy, an ideal function for MCUs.
This interview with HITACHI Solutions Technology details their adoption of the RX72N MCU for easy improvement of system performance and functionality and easy development for the long-term.
In this post, we will look at how the 10BASE-T1S and CAN XL protocols could be used in a system and what is necessary to connect CAN XL and 10BASE-T1S to an IVN backbone.
在此博客中,我们将解释瑞萨电子如何通过新型R-Car S4为汽车市场带来更美好未来。
在这篇博客中,我们将讨论电快速瞬变 (EFT) 是如何引起的,如何测量收发器 EFT 性能,以及 RS-485 收发器的 EFT 测量结果。
介绍基于全新入门级 RA 系列 RA2E2 单片机组的 I3C 接口,适用于 DDR5 DIMM LED 控制应用。
在本文中,我们将介绍 Smart Configurator 工具的新电路板功能。此功能将帮助您选择与您的瑞萨电路板完美配合的软件组件(即中间件和驱动程序)。